ISSN:
1662-9779
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Physik
Notizen:
The residual stress distribution of microstructure about Cu-Fe-P alloy for leadframe is simulated by finite element method of elastic-plastics deformation. The effect of thedensity of Fe particle on residual stress is mainly analyzed. It is indicated that the larger thedensity of particle is, the larger residual stress in particle and matrix near the interface is, andthe larger stress difference between both the sides is. When the density of Fe particle is 35%and the compressive extent of cold rolling is 25%, in the X-direction, the stress variation ofthe Cu matrix is from compressive 900MPa to tensile 1480MPa, and stress of the Fe particleis about compressive 246MPa. The maximum residual stress gradient near the interfacebetween Cu matrix and Fe particle reaches 1726MPa. The bigger stress concentration andresidual stress will destroy the quality of the material. Even peelings on the surface occur. Sothe appearance of bigger Fe particle goes against the quality of the material, and it should beavoided as far as possible in the production of Cu-Fe-P alloy for lead frame
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/22/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.118.393.pdf
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