Keywords:
Forschungsbericht
Description / Table of Contents:
Flip Chip technology, underfilling, encapsulation, material characterization, reliability analysis, thermal conductivity
Type of Medium:
Online Resource
Pages:
Online-Ressource ([2], 20 p., 1,32 Mb.)
,
ill., graphs
Edition:
[Elektronische Ressource]
URL:
https://edocs.tib.eu/files/e01fb02/361876874.pdf
URL:
https://edocs.tib.eu/files/e01fb02/361876874l.pdf
Language:
German
,
English
Note:
Differences between the printed and electronic version of the document are possible. - Contract BMBF 03 N 3058 E. - joint project number 01013309. - Engl. abstract under title: Characterization of underfill materials regarding thermal and thermomechanical properties and analysis of the reliability behavior of Flip Chip assemblies "PUMA-IZM" within the project "PUMA". - nBibliography p. 20
,
Also available as printed version
,
Systemvoraussetzungen: Acrobat Reader.
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