In:
Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 609-610 ( 2014-4), p. 55-63
Abstract:
This paper reports a novel and facile activation process for electroless copper plating on Acrylonitrile Butadiene Styrene (ABS) plastic substrate using gold nanoparticles as catalyst. Gold nanoparticles were prepared by chemical reduction method and characterized by UVvisible adsorption spectrum and transmission electron microscope (TEM). The gold nanoparticles were sphere-like with a size of less than 50 nm. Gold nanoparticles were adsorbed on ABS surface and acted as nucleation centers in activating process of the electroless copper plating. The uniform and dense film was obtained at the optimal technological parameters which were achieved by the orthogonal experiment. The scanning electron microscope (SEM), energy dispersive spectrometer (EDS), X-ray diffractometer (XRD) and X-ray photoelectron spectroscopy (XPS) were used to detect the morphology, structure and elemental composition of the coating, respectively. The results indicated that copper coating contained only Cu (0) without any other elements.
Type of Medium:
Online Resource
ISSN:
1662-9795
DOI:
10.4028/www.scientific.net/KEM.609-610
DOI:
10.4028/www.scientific.net/KEM.609-610.55
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2014
detail.hit.zdb_id:
2073306-9
