In:
Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 326-328 ( 2006-12), p. 345-348
Abstract:
Nanoimprint lithography is a promising technology to produce sub-100 nm scale features
on silicon chips. One of key issues in the nanoimprint lithography is how to make uniform contact between the stamp and the substrate on a large area. In this study a rubber membrane unit under
substrate is introduced to resolve this problem. Two layers of membrane were designed to consider air flow in the middle of resist on a silicon wafer. The geometry design for accomplishing uniform
contact was carried out using finite element analysis. The material modeling of hyperelastic properties of rubber is characterized by the Mooney-Rivlin strain energy functions. Material
constants in the strain energy functions are able to be determined via the curve fitting of experimental stress-strain data. Simple tension and equi-biaxial tests were performed to determine
the material constants. To evaluate the effects of a rubber membrane unit, nanoimprint lithography process with it was executed. We could confirm that a distinct improvement of uniform contact was
shown and air flow problem was solved during the process.
Type of Medium:
Online Resource
ISSN:
1662-9795
DOI:
10.4028/www.scientific.net/KEM.326-328
DOI:
10.4028/www.scientific.net/KEM.326-328.345
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2006
detail.hit.zdb_id:
2073306-9
