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    Preparation and Property of SnXCuNiBi Solder Alloy
    Trans Tech Publications, Ltd. ; 2010
    In:  Advanced Materials Research Vol. 146-147 ( 2010-10), p. 485-490
    Details
    In: Advanced Materials Research, Trans Tech Publications, Ltd., Vol. 146-147 ( 2010-10), p. 485-490
    Abstract: Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder. In this paper, 0.6% Bi was added into SnXCuNi solder alloy to produce lead-free solder at low cost and high performance. Microstructure, phase composition, melting point, wettability and characteristics of weld interface have been studied and analyzed. The results show that SnXCuNiBi solder alloy are mainly composed of βSn, SnX, Cu6Sn5 and SnBi. The addition of Bi reduces the melting point and improves the wettability of the solder. The main component of the joint interface of SnXCuNiBi/Cu system is Cu6Sn5, which has shown the capability to keep relatively high shear strength at the joint interface.
    Type of Medium: Online Resource
    ISSN: 1662-8985
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/AMR.146-147
    DOI: 10.4028/www.scientific.net/AMR.146-147.485
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2010
    detail.hit.zdb_id: 2265002-7
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