In:
International Journal of Materials Research, Walter de Gruyter GmbH, Vol. 100, No. 5 ( 2009-05-01), p. 672-676
Abstract:
Interfacial reactions between Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and an Au/Ni/SUS304 stainless steel (SUS304) substrate were conducted using the reaction couple technique at 240, 255 and 270 °C for 1 – 5 h. In the earliest stage of the reaction, only the Ni 3 Sn 4 phase was formed on the Sn/Au/Ni/SUS304 interface. As the reaction time increased to 4 h, the Ni layer was gradually consumed and the Ni 3 Sn 4 phase detached from the interface. Meanwhile, the Sn reacted with the SUS304 to form the FeSn 2 phase. In the SAC/Au/Ni/SUS304 reaction couple, both Ni 3 Sn 4 and Cu 6 Sn 5 phases were formed on the interface. When the reaction time exceeded 4 h, the Ni 3 Sn 4 phase disappeared; the Cu 6 Sn 5 phase was spread over the SUS304 surface and the FeSn 2 phase was formed on the SUS304 surface. The growth of intermetallic compounds can be described by the parabolic law and the reactions were diffusion-controlled.
Type of Medium:
Online Resource
ISSN:
2195-8556
,
1862-5282
Language:
English
Publisher:
Walter de Gruyter GmbH
Publication Date:
2009
detail.hit.zdb_id:
2232675-3
detail.hit.zdb_id:
2128058-7
detail.hit.zdb_id:
203021-4
