In:
Journal of Materials Research, Springer Science and Business Media LLC, Vol. 30, No. 4 ( 2015-02-28), p. 521-527
Abstract:
A method based on the electroforming technique has been proposed for the fabrication of nanoparticle-reinforced copper-matrix composites using an electrolyte of copper sulfate–sulfuric acid solution containing 1 cm 3 /L of the nanoparticles without surfactants. Of the tested nanoparticles such as Al 2 O 3 , SiO 2 , TiO 2 , ZrO 2 , and CeO 2 , whose sizes ranged from 10 to 30 nm, only TiO 2 nanoparticles were successfully embedded in the copper matrix during electroforming, owing to their positive charge in the electrolyte solution. It should be noted that there was very little contamination in the copper matrix, because surfactants were absent during electroforming. Therefore, the electrical conductivity of the specimen that was electroformed in the electrolytes with TiO 2 nanoparticles was not significantly different from that of pure copper. Nevertheless, the hardness, yield, and ultimate tensile strength were significantly improved by a small amount (0.3 mass%) of TiO 2 nanoparticles primarily because of strengthening by Orowan mechanics. The electroforming process is thus a promising means to prepare copper-matrix composites with an excellent balance of electrical conductivity and mechanical strengths.
Type of Medium:
Online Resource
ISSN:
0884-2914
,
2044-5326
DOI:
10.1557/jmr.2014.401
Language:
English
Publisher:
Springer Science and Business Media LLC
Publication Date:
2015
detail.hit.zdb_id:
54876-5
detail.hit.zdb_id:
2015297-8
