In:
Journal of Applied Physics, AIP Publishing, Vol. 78, No. 3 ( 1995-08-01), p. 1719-1724
Abstract:
A new technique on the formation of TiN film with large grain size from TiNx is described. The TiNx layer (defined in Sec. II A) was deposited by sputtering in argon and nitrogen. The nitrogen atoms in Ti matrix relaxed the mechanical stress of the deposited film and limited the surface mobility during the deposition process, resulting in a nanocrystalline structure with extremely uniform thickness. After rapid thermal annealing (RTA), the TiNx yielded a bilayer structure of TiN/TiSixOy, in which the TiN showed (111) preferred texture, extremely smooth surface, and large grain size without any columnar structure. In addition, the resistivity of the bilayered TiN was as low as 40 μΩ cm. In the TiN multilayered aluminum structure (i.e., TiN/Al/TiN), epitaxial continuity and the intermetallic compound such as TiAl3 were clearly observed at the aluminum/TiN interface. The multilayered structure showed better endurance against EM in comparison with the same structure using the conventional TiN (also defined in Sec. II A).
Type of Medium:
Online Resource
ISSN:
0021-8979
,
1089-7550
Language:
English
Publisher:
AIP Publishing
Publication Date:
1995
detail.hit.zdb_id:
3112-4
detail.hit.zdb_id:
1476463-5