In:
Applied Physics Letters, AIP Publishing, Vol. 98, No. 16 ( 2011-04-18)
Abstract:
The authors report upon a low-resistance Ni/Al Ohmic contact to a nonpolar n-type a-plane GaN with respect to the annealing temperature. The Schottky behavior of the Ni/Al contact changes to a linear Ohmic behavior at a 700 °C annealing, at which the specific contact resistivity of the Ni/Al contact became as low as 5.8×10−5 whereas that of a typical Ti/Al contact was 1.6×10−3 Ω cm2. This improvement is attributed to a lowering of the Schottky barrier height via a Ni–Al interdiffused layer, formed at the interface between the metal and the nonpolar a-plane n-type GaN during the annealing process.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2011
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0