In:
Materials and Corrosion, Wiley, Vol. 69, No. 11 ( 2018-11), p. 1597-1608
Abstract:
(NH 4 ) 2 SO 4 is abundant in the dust of the rural and industrial atmosphere, by which a thin layer of (NH 4 ) 2 SO 4 solution will be formed on the copper surface and give rise to serious corrosion as soon as the ambient humidity gets the critical relative humidity. In this work, the corrosion mechanism of copper in (NH 4 ) 2 SO 4 solution was studied by microgravimetry associated with SEM/EDS, FT‐IR, XRD, titration method, and electrochemical tests. The results suggest that the corrosion of copper is not only caused by electrochemical effect, but also caused by the synergistic actions of the electrochemical and chemical reactions. In addition, it is found that the presence of free Cu 2+ is the prerequisite for the formation of corrosion products on copper immersed in (NH 4 ) 2 SO 4 solution. NH 4 + plays a dual role in promoting the corrosion of copper and inhibiting the formation of corrosion products on copper surface.
Type of Medium:
Online Resource
ISSN:
0947-5117
,
1521-4176
DOI:
10.1002/maco.201810222
Language:
English
Publisher:
Wiley
Publication Date:
2018
detail.hit.zdb_id:
1481051-7
detail.hit.zdb_id:
1224916-6
