Distribution & Access For Publication Downloads News About Us Contact Us
Paper Titles
Crystal Structure of Al2Cu3Nd Ternary Compound
p.8
Kinetics of Dynamic Recrystallization of 18 Ni Maraging Steels
p.13
Thermodynamic Re-Assessment of the Mn-La Binary System
p.21
Thermodynamic Calculations of the Rare Earth Permanent Magnets: Fe-RE Binary Systems
p.27
Compression Deformation Flow Stress Behavior and Prediction of Pure Copper
p.33
Fracture Toughness Analysis of the China RPV Steel with Miniaturized Specimen
p.41
Plastic Deformation and Recrystallization of a Ni-Based Single Crystal Superalloy
p.47
Effect of Salt-Deposit Hot Corrosion on Creep Rupture Behaviors of DZ466 Superalloy
p.56
Torsion Failure Analysis of 0Cr17Ni7Al Precipitation Hardening Stainless Steel Wire
p.66

Compression Deformation Flow Stress Behavior and Prediction of Pure Copper

Article Preview

Abstract:

The deformation characteristics of pure copper have been investigated by compression tests in the temperature range of 20 °C~900 °C and strain rate range of 0.001 s-1~1 s-1. The results showed that the flow stress of pure copper increased with increasing strain rate and decreasing deformation temperature. Three types of strain-contained flow stress prediction models were developed. The flow stress prediction models based on parameters such as α, Q, lnA and n were related to deformation temperature, strain rate and strain, the prediction accuracy of the flow stress was deeply influenced by the cumulative error of multi-parameter fitting. The flow stress prediction model based on σ, , ε and T constitutive relations and the flow stress prediction model based on GA+BP possessed less correlation with microscopic deformation mechanism, proving to have high prediction accuracy, in which GA+ BP-based flow stress prediction model is in very good agreement with true stress curve, which is of significance to the guidance of hot working of pure copper.

You might also be interested in these eBooks
Methods of Design and Characterization of Materials, Research and Development of Technological Processes View Preview

Info:

Periodical:

Materials Science Forum (Volume 850)

Pages:

33-40

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.850.33

Citation:

Cite this paper

Online since:

March 2016

Authors:

Shu Hai Huang*, Shu Xin Chai, Xiang Sheng Xia, Da Yu Shu

Keywords:

Compression Deformation, Flow Stress, Pure Copper, Stress Prediction

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

* - Corresponding Author

References

[1] W.H. Tian, A.L. Fan, H.Y. Gao, J. Luo, Z. Wang. Comparison of microstructures in electroformed copper liners of shaped charges before and after plastic deformation at different strain rates, Mater. Sci. Eng. A. 350(2003)160-167.

DOI: 10.1016/s0921-5093(02)00721-9

Google Scholar

[2] FAN Ai-Iing, LI Shu-kui, TIAN Wen-huai, WANG Fu-chi. Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge undergone high-strain-rate deformation, Trans. Nonferrous Met. Soc. China. 17(2007)1447-1450.

DOI: 10.1016/s1003-6326(07)60292-1

Google Scholar

[3] A.L. Fan, S.K. Li, W.H. Tian. Grain growth and texture evolution in electroformed copper liners of shaped charges, Mater. Sci. Eng. A. 474(2008)208-213.

DOI: 10.1016/j.msea.2007.04.001

Google Scholar

[4] Oksana Ozhoga-Maslovskaja, Konstantin Naumenko, Holm Altenbach, Oleksandr Prygorniev. Micromechanical simulation of grain boundary cavitation in copper considering non-proportional loading, Comp. Mater. Sci. 96(2015)178-184.

DOI: 10.1016/j.commatsci.2014.08.050

Google Scholar

[5] Wang Zhanlei, Wang Huiping, Hou Zhonghua, Xu Hongyu, Li Yifan. Dynamic Consolidation of W-Cu Nano-Alloy and Its Performance as Liner Materials, RARE METAL MAT ENG. 43, 5(2014)1051-1055.

DOI: 10.1016/s1875-5372(14)60099-0

Google Scholar

[6] TAN Cheng-wen, XU Shan-na, WANG Lu, CHEN Zhi-yong, WANG Fu-chi, CAI Hong-nian, MA Hong-lei. Deformation behavior of AZ31 magnesium alloy at different strain rates and temperatures, Trans. Nonferrous Met. Soc. China. 17(2007)347-352.

Google Scholar

[7] Zhang Fei, Shen Jian, Yan Xiaodong, Sun Jianlin. Constitutive Analysis to Predict High-Temperature Flow Stress in 2099 Al-Li Alloy, RARE METAL MAT ENG. 43, 6 (2014) 1312-1318.

DOI: 10.1016/s1875-5372(14)60114-4

Google Scholar

[8] Wei Li, Hai Li, Zhixiu Wang, Ziqiao Zheng. Constitutive equations for high temperature flow stress prediction of Al–14Cu–7Ce alloy, Mater. Sci. Eng.A. 528(2011)4098–4103.

DOI: 10.1016/j.msea.2011.01.076

Google Scholar

[9] M.A. Jabbari Taleghani, E.M. Ruiz Navas, M. Salehi, J.M. Torralba. Hot deformation behaviour and flow stress prediction of 7075 aluminium alloy powder compacts during compression at elevated temperatures, Mater. Sci. Eng.A. 534(2012)624–631.

DOI: 10.1016/j.msea.2011.12.019

Google Scholar

[10] H. Mirzadeh, A. Najafizadeh. Flow stress prediction at hot working conditions, Mater. Sci. Eng.A. 527(2010)1160–1164.

DOI: 10.1016/j.msea.2009.09.060

Google Scholar

[11] Amit Kumar Maheshwari. Prediction of flow stress for hot deformation processing, Comp. Mater. Sci. 69(2013)350–358.

Google Scholar

[12] Siamak Serajzadeh, Ali Karimi Taheri. Prediction of flow stress at hot working condition, Mech. Res. Commun. 30(2003)87–93.

DOI: 10.1016/s0093-6413(02)00354-3

Google Scholar

[13] Guo-zheng Quan, Wen-quan Lv, Yuan-ping Mao, Yan-wei Zhang, Jie Zhou. Prediction of flow stress in a wide temperature range involving phase transformation for as-cast Ti–6Al–2Zr–1Mo–1V alloy by artificial neural network, Mater Des. 50(2013)51–61.

DOI: 10.1016/j.matdes.2013.02.033

Google Scholar

[14] Amit Kumar Gupta, Swadesh Kumar Singh, Swathi Reddy, Gokul Hariharan. Prediction of flow stress in dynamic strain aging regime of austenitic stainless steel 316 using artificial neural network, Mater Des. 35(2012)589–595.

DOI: 10.1016/j.matdes.2011.09.060

Google Scholar

[15] P. Vo, M. Jahazi, S. Yue, P. Bocher. Flow stress prediction during hot working of near-α titanium alloys, Mater. Sci. Eng. A. 447(2007)99–110.

DOI: 10.1016/j.msea.2006.10.032

Google Scholar

Scientific.Net is a registered brand of Trans Tech Publications Ltd
© 2024 by Trans Tech Publications Ltd. All Rights Reserved