Abstract
This project develops an electro-optical board technology based on the combination of discrete wiring and glass optical fibers.
Such a board provides optical parallel interconnects. Meaning that 16 optical fibers will be led simultaneously in and out the board from the incomming links to the transmitter and receiver modules mounted on this board.
This technology is expected to fulfil the needs of next generation broadband exchanges concerning high data rate flow.
As the ligning-up of the fibers requires severe dimensional tolerances, we have to enter the field of the micromechanica. The most critical parts will therefore be manufactured with the LIGA technique.
The first generation of models produced and tested by Alcatel Bell Telephone proved that this concept is perfectly feasible.
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References
W. Delbare, L. Vandam, J. Vandewege, J. Verbeke, M. Fitzgibbon: “Electrooptical Board Technology based on Discrete Wiring” Circuit World Vol. 18, No. 3, pp. 11–15, 1992
UETP-MEMS Training in Microsystems, June 21, 1994, Mainz
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Leyssens, F., Vetter, P. & Allaert, K. Micromechanical structures for optical fibers in board. Microsystem Technologies 1, 111–114 (1995). https://doi.org/10.1007/BF01294800
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DOI: https://doi.org/10.1007/BF01294800