Hyperbolic dispersion and negative refraction in a metal-organic framework Cu-BHT

Han Gao, Zhenhai Wang, Xikui Ma, Xiaoming Zhang, Weifeng Li, and Mingwen Zhao
Phys. Rev. Materials 3, 065206 – Published 26 June 2019

Abstract

Hyperbolic (or indefinite) materials that have been extensively studied in artificial electromagnetic metamaterials are attracting increasing interest due to their unusual optical properties, which enable useful functionalities in emerging devices based on light. Natural hyperbolic materials have many obvious advantages over metamaterials, most of which are inorganic. Here, using first-principles calculations, we demonstrated a metal-organic framework in the form of a natural hyperbolic material, Cu-benzenehexathial (Cu-BHT), which has been synthesized and proved to be a superconductor in recent experiments. Cu-BHT exhibits hyperbolic dispersion, i.e., all-angle negative refraction over a broad frequency from near-IR (∼1.4 μm) to the visible regime (∼750 nm). The operating hyperbolic window can be effectively tuned by applying uniaxial strain along the optical direction, constructing van der Waals heterostructures with BN or graphene or electron doping. This work is expected to offer a promising platform for the design of high-performance natural hyperbolic materials with great potential for applications.

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  • Received 28 February 2019

DOI:https://doi.org/10.1103/PhysRevMaterials.3.065206

©2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied PhysicsPlasma Physics

Authors & Affiliations

Han Gao1, Zhenhai Wang2,3, Xikui Ma1, Xiaoming Zhang1, Weifeng Li1, and Mingwen Zhao1,*

  • 1School of Physics and State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China
  • 2School of Telecommunication and Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing, Jiangsu 210003, China
  • 3Skolkovo Institute of Science and Technology, Skolkovo Innovation Center, 3 Nobel Street, Moscow 143026, Russia

  • *Author to whom all correspondence should be addressed: zmw@sdu.edu.cn

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Issue

Vol. 3, Iss. 6 — June 2019

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