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  • 1
    Electronic Resource
    Electronic Resource
    Westerville, Ohio : American Ceramics Society
    Journal of the American Ceramic Society 81 (1998), S. 0 
    ISSN: 1551-2916
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A detailed study has been undertaken on crack healing at high temperatures in a silicon nitride containing 10 wt% additives in order to identify the dominant mechanism responsible for the phenomenon. Fracture toughness increased with annealing time and the crack growth rate decreased until arrest with increasing testing time. Differentiation between possible operating mechanisms was obtained using critical experiments involving detailed compliance measurements, crack wake removal, and crack reinitiation tests and a comprehensive TEM study of healed cracks. It was found that crack healing was not uniform in the crack wake. When the original crack path was either transgranular or intergranular, healing was associated with the appearance of a thin layer of silica glass due to the oxidation of Si3N4 grains. But when the crack went through multigrain junctions, the former crack path was completely obliterated and replaced by a new, crystalline phase formed by diffusion of the preexisting glass phase. It is concluded that the increased crack growth resistance and fracture toughness at high temperature is attributable to the partial recovery of the original strength from the crack segments at multigrain junctions due to vitreous phase flow and subsequent crystallization.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Westerville, Ohio : American Ceramics Society
    Journal of the American Ceramic Society 84 (2001), S. 0 
    ISSN: 1551-2916
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A study was made of the wet erosive wear of polycrystalline alumina of mean grain size 〉1 μm, containing up to 10 wt% of magnesium silicate sintering aid. For pure polycrystalline alumina, the dominant wear mechanism was grain-boundary microfracture, leading to partial or complete grain removal. In the case of the liquid-phase-sintered materials, wear rates could be as low as 25% of those of pure alumina of the same mean grain size, and the main material removal mechanism was transgranular fracture combined with tribochemical wear. The use of Cr3+ photoluminescence line broadening showed much higher levels of local stress in the magnesium silicate-sintered materials (∼450 MPa) than in the pure-alumina materials (∼200 MPa). Grain-boundary compressive hoop stresses, caused by the thermal expansion mismatch between a continuous magnesium silicate film and the alumina grains, provided an explanation for the improved wear resistance of the alumina sintered with magnesium silicate.
    Type of Medium: Electronic Resource
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