Keywords:
Forschungsbericht
Type of Medium:
Online Resource
Pages:
Online-Ressource (29 p., 902 Kb.)
,
ill., graphs
Edition:
[Elektronische Ressource]
Series Statement:
Qualifizierung des Underfillings für Flip-Chip-Produktapplikationen in der Serienfertigung - QUAPRO Teilprojekt
URL:
https://edocs.tib.eu/files/e01fb02/373237510.pdf
URL:
https://edocs.tib.eu/files/e01fb02/373237510l.pdf
Language:
German
Note:
Contract BMBF 16 SV 1065. - Differences between the printed and electronic version of the document are possible
,
Also available as printed version
,
Systemvoraussetzungen: Acrobat reader.
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