ISSN:
1432-0630
Keywords:
PACS: 42.62; 85.60.J; 52.75.R
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract. Sapphire wafer is found to be scribed and cut freely by plasma from a metal surface on which a Q-switched Nd:YAG laser beam is focused through the wafer. The wafer is scribed enough to be cut using a Q-switched Nd:YAG laser with the average power of 5 W at atmospheric environment without a vacuum chamber. This method is successfully applied to split each device from a blue LED wafer including about 10000 blue LED devices grown on a sapphire wafer.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s003390051080
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