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  • 1
    Online Resource
    Online Resource
    Flexible Electronic Packaging and Encapsulation Technology. (2024)
    Newark :John Wiley & Sons, Incorporated,
    Details
    Keywords: Electronic books.
    Type of Medium: Online Resource
    Pages: 1 online resource (379 pages)
    Edition: 1st ed.
    ISBN: 9783527845705
    URL: https://ebookcentral.proquest.com/lib/geomar/detail.action?docID=31227211
    Language: English
    Note: Cover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Overview of Flexible Electronic Encapsulating Technology -- 1.1 Flexible Electronics Overview -- 1.2 Development of Flexible Electronic Encapsulating Technology -- 1.2.1 Flip Chip Process -- 1.2.2 Progress of CIF‐Based Flexible Electronic Encapsulating Technology -- 1.3 Encapsulating Technology of Several Important Flexible Electronic Devices -- 1.3.1 Organic Light‐Emitting Diode -- 1.3.2 Flexible Solar Cell Encapsulating -- 1.3.3 Flexible Amorphous Silicon Solar Cells -- 1.3.4 Flexible Perovskite Solar Cells -- 1.4 Flexible Electronic Encapsulating Materials -- 1.4.1 Selection Principle of Flexible Electronic Encapsulating Materials -- 1.4.2 Desirable Properties of Flexible Electronic Encapsulating Materials -- 1.5 Overview of the Development of Flexible Electronic Packaging at Home and Abroad -- References -- Chapter 2 Basic Concepts Related to Flexible Electronic Packaging -- 2.1 Composition of Flexible Electronic Packaging -- 2.1.1 Flexible Substrate -- 2.1.2 Electronic Components -- 2.1.3 Crosslinked Conductive Materials -- 2.1.4 Adhesive Layer -- 2.1.5 Coating Layer -- 2.2 Flexible Electronic Packaging Structure -- 2.2.1 Curved Structures of Hard Thin Films -- 2.2.2 Island‐Bridge Structure -- 2.2.3 Pre‐strained Super‐Soft Interconnect Structure -- 2.2.4 Open Grid Structure -- 2.3 Encapsulation Principle -- 2.3.1 Basic Principle of Penetration -- 2.3.2 Permeation Mechanism of Water Vapor and Gas -- 2.3.3 Barrier Performance Measurement -- 2.3.4 Thin‐Film Barrier Technology for Organic Devices -- 2.3.4.1 Single‐Layer Film Package -- 2.3.4.2 Multilayer Film Packaging -- 2.3.5 Film Encapsulation Mechanics -- 2.4 Packaging Technology -- 2.4.1 Local Multilayer Packaging -- 2.4.2 Multilayer Barrier Film Packaging -- 2.4.3 Online Thin‐Film Encapsulation. , 2.4.4 Atomic Layer Deposition (ALD) Encapsulation -- 2.4.5 Inkjet Packaging -- 2.4.6 Flexible Glass Packaging -- 2.5 Packaging Stability -- 2.6 Encapsulated Products -- 2.7 Chapter Summary -- References -- Chapter 3 Flexible Substrates -- 3.1 Concept and Connotation of Flexible Substrates -- 3.2 Development History of Flexible Substrates -- 3.3 Flexible Substrate Materials -- 3.3.1 Polydimethylsiloxane -- 3.3.2 Polyvinyl Alcohol -- 3.3.3 Polycarbonate -- 3.3.4 Polyester -- 3.3.5 Polyimide -- 3.3.6 Polyurethane -- 3.3.7 Parylene -- 3.3.8 Liquid Crystal Polymer -- 3.3.9 Hydrogel -- 3.4 Molding Technology of Flexible Substrate -- 3.4.1 Coating Technology -- 3.4.1.1 Dip Coating Method -- 3.4.1.2 Air Knife Coating Method -- 3.4.1.3 Scraper Coating Method -- 3.4.1.4 Rotary Coating Method -- 3.4.2 Melt Extrusion Molding -- 3.4.3 Melt Extrusion Blow Molding -- 3.4.4 Solution Tape Casting -- 3.4.5 Bidirectional Drawing Molding -- 3.4.6 Chemical Vapor Deposition -- 3.5 Performance Evaluation of Flexible Substrates -- 3.5.1 Mechanical Flexibility -- 3.5.2 Ductility -- 3.5.3 Adhesive Property -- 3.5.4 Barrier Property -- 3.5.5 Electrical Property -- 3.5.6 Chemical Stability -- 3.5.7 Dimensional Stability -- 3.5.8 Surface Smoothness and Thickness Uniformity -- 3.5.9 Optical Clarity (Transmittance) -- 3.5.10 Biocompatibility -- 3.5.11 Bioabsorbability -- 3.6 Application of Flexible Substrates -- 3.6.1 Flexible Display Substrates -- 3.6.2 Flexible Electrode Substrates -- 3.6.3 Flexible Sensing Substrates -- 3.7 Development Trend of Flexible Substrates -- 3.7.1 Intelligent and Functional Flexible Substrates -- 3.7.2 Green Degradable Flexible Substrates -- 3.7.3 Optimization of Interface Compatibility of Flexible Substrates -- References -- Chapter 4 Test Methods -- 4.1 Sealing Test -- 4.1.1 Direct Diffusion Method -- 4.1.1.1 Weight Cup Test. , 4.1.1.2 Differential Pressure Method -- 4.1.1.3 Balancing Method -- 4.1.1.4 Tunable Diode Laser Absorption Spectrometry -- 4.1.1.5 Isotope Labeling Mass Spectrometry -- 4.1.2 Indirect Optical Method -- 4.1.3 Indirect Electrical Method -- 4.1.3.1 Calcium Electrical Test -- 4.1.3.2 Dielectric Measurement Method -- 4.1.4 Indirect Electrochemical Method -- 4.1.4.1 Electrochemical Impedance Spectroscopy (EIS) -- 4.1.4.2 Leakage Current Monitoring Method (LCM) -- 4.1.4.3 Linear Scanning Voltammetry (LSV) -- 4.1.5 Indirect Electromechanical Method -- 4.2 Bending Test -- 4.2.1 Static Bending and Dynamic Bending -- 4.2.2 Three‐Point Bending and Four‐Point Bending -- 4.2.3 Push Bending and Roll Bending -- 4.2.3.1 Push Bending -- 4.2.3.2 Rolling Bend -- 4.3 Mechanical Performance Testing -- 4.4 Stability Testing -- References -- Chapter 5 Flexible Electronic Encapsulation -- 5.1 Inorganic Encapsulating Material -- 5.1.1 Metal Encapsulating Material -- 5.1.1.1 Copper, Aluminum -- 5.1.1.2 Favorable Alloys -- 5.1.1.3 Copper-Tungsten Alloy (Cu-W) -- 5.1.2 Ceramic Encapsulating Material -- 5.1.2.1 Al2O3 Ceramic Encapsulation Material -- 5.1.2.2 AlN Ceramic Encapsulation Materials -- 5.1.2.3 BeO Ceramic Encapsulation Material -- 5.1.2.4 BN Ceramic Encapsulation Materials -- 5.1.3 New Trend in Inorganic Encapsulating Materials Combined with Flexible Electronic Technology -- 5.2 Organic Encapsulating Material -- 5.2.1 Polymer Encapsulating Material -- 5.2.1.1 Epoxy Resins -- 5.2.1.2 Polyimide Resins -- 5.2.1.3 Organic Silicon -- 5.2.1.4 Bismaleimide -- 5.2.1.5 Bismaleimide Triazine Resin -- 5.2.2 Development Trend of Organic Encapsulating Materials in Flexible Electronic Devices -- 5.3 Organic-Inorganic Hybrid Encapsulating Material -- 5.3.1 Application of Organic-Inorganic Hybrid Materials in Flexible Electronics -- 5.3.1.1 Strain and Pressure Sensors. , 5.3.1.2 Temperature Sensor -- 5.3.1.3 Humidity Sensor -- 5.3.1.4 Optical Sensors -- 5.3.1.5 Other Types of Sensing Devices -- 5.3.2 Development Trends of Organic-Inorganic Hybrid Materials -- References -- Chapter 6 Development of Flexible Electronics Packaging Technology -- 6.1 Flexible Electronics Packaging -- 6.1.1 Single‐Layer Thin‐Film Packaging -- 6.1.2 Multi‐Layer Thin‐Film Packaging -- 6.1.2.1 Barix Multilayer Thin‐Film Packaging -- 6.1.2.2 Other Multilayer Thin‐Film Packaging -- 6.2 Thin‐Film Packaging Technology -- 6.2.1 PECVD Atomic Layer Deposition Packaging Technology -- 6.2.1.1 Introduction to PECVD Technology -- 6.2.1.2 Development of PECVD Technology -- 6.2.2 ALD Atomic Layer Deposition Packaging Technology -- 6.2.2.1 Introduction to ALD Technology -- 6.2.2.2 Development of ALD Technology -- 6.2.3 Inkjet Packaging Technology -- 6.2.3.1 Introduction to Inkjet Encapsulation Technology -- 6.2.3.2 Continuous Inkjet Printing -- 6.2.3.3 Drop‐on‐Demand Inkjet Printing -- 6.2.3.4 Development of Inkjet Printing Technology -- References -- Chapter 7 Application of Flexible Electronics Packaging -- 7.1 Industry Chain Analysis of Flexible Electronics Packaging -- 7.1.1 Upstream, Midstream, and Downstream of the Flexible Electronics Industry Chain -- 7.1.2 Overview of the Development of Flexible Packaging Materials -- 7.2 Packaging Applications of Flexible OLED Devices -- 7.2.1 Stability Issues of Flexible OLED Devices -- 7.2.2 Flexible OLED Packaging Technology -- 7.2.2.1 Lack of Breakthrough in Encapsulating Technology -- 7.2.2.2 Low Yield Rate -- 7.3 Packaging Applications for Flexible Solar Cells -- 7.3.1 Inorganic Flexible Solar Cells -- 7.3.2 Organic Flexible Solar Cells -- 7.3.3 Dye‐Sensitized Solar Cells -- 7.3.3.1 Structure of Dye‐Sensitized Solar Cells -- 7.3.3.2 Light Anode -- 7.3.3.3 Counter Electrode. , 7.4 Packaging Applications for Flexible Electronic Devices -- 7.4.1 Basic Structure of Flexible Electronic Devices -- 7.4.2 Application of Flexible Electronic Devices -- 7.4.2.1 Optoelectronics -- 7.4.2.2 Robot -- 7.4.2.3 Biomedical -- 7.4.2.4 Energy Equipment -- 7.5 Packaging Applications for Flexible Electronics Sensors -- 7.5.1 Common Materials of Flexible Sensors -- 7.5.1.1 Flexible Substrate -- 7.5.1.2 Metal Materials -- 7.5.1.3 Inorganic Semiconductor Materials -- 7.5.1.4 Organic Materials -- 7.5.1.5 Carbon Materials -- 7.5.2 Flexible Gas Sensors -- 7.5.3 Flexible Pressure Sensors -- 7.5.4 Flexible Humidity Sensor -- 7.5.5 Normal Sensors Compare with Flexible Sensors -- References -- Chapter 8 Testing Standards -- 8.1 Terminology and Alphabetic Symbols -- 8.1.1 Scope -- 8.1.2 Terms and Definitions -- 8.1.2.1 Terminology Classification -- 8.1.2.2 General Terms -- 8.1.2.3 Physical Characteristics Related Terms -- 8.1.2.4 Terms Related to Construction Elements -- 8.1.2.5 Symbols Related to Performances and Specifications -- 8.1.2.6 Terms Related to the Production Process -- 8.1.3 Alphabetic Symbols (Quantity Symbols/Unit Symbols) -- 8.1.3.1 Classification -- 8.1.3.2 Symbols -- 8.2 Mechanical Test Method (Deformation Test) -- 8.2.1 Cyclic Bending Test -- 8.2.1.1 Purpose -- 8.2.1.2 Testing Device -- 8.2.1.3 Test Procedure -- 8.2.1.4 Test Conditions and Reports -- 8.2.2 Static Bending Test -- 8.2.2.1 Purpose -- 8.2.2.2 Testing Device -- 8.2.2.3 Test Steps -- 8.2.2.4 Test Conditions and Reports -- 8.2.3 Combined Bending Test -- 8.2.3.1 Purpose -- 8.2.3.2 Testing Device -- 8.2.3.3 Test Procedure -- 8.2.3.4 Test Conditions and Reports -- 8.2.4 Rolling Test -- 8.2.4.1 Purpose -- 8.2.4.2 Testing Device -- 8.2.4.3 Test Procedure -- 8.2.4.4 Test Conditions and Reports -- 8.2.5 Static Rolling Test -- 8.2.5.1 Purpose -- 8.2.5.2 Testing Device. , 8.2.5.3 Test Procedure.
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  • 2
    Online Resource
    Online Resource
    Perovskite Light Emitting Diodes : Materials and Devices. (2024)
    Newark :John Wiley & Sons, Incorporated,
    Details
    Keywords: Electronic books.
    Type of Medium: Online Resource
    Pages: 1 online resource (371 pages)
    Edition: 1st ed.
    ISBN: 9783527844937
    URL: https://ebookcentral.proquest.com/lib/geomar/detail.action?docID=31042588
    Language: English
    Note: Cover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Structure and Physical Properties of Metal Halide Perovskites -- 1.1 Crystal Structure of Perovskite Materials -- 1.2 Exciton Effects in Perovskite Materials -- 1.2.1 Definition of an Exciton -- 1.2.2 Self‐Trapping Excitons in Perovskite Materials -- 1.3 Size Effect of Perovskite Materials -- 1.4 Luminescence Properties of Perovskite Materials -- 1.4.1 Photon Generation in Perovskite Materials -- 1.4.2 Photophysical Processes and Efficiency Calculations of Perovskite Luminescence -- 1.4.3 Non‐radiative Combination Mechanisms at Surfaces and Interfaces -- 1.5 Factors Influencing the Efficiency of Perovskite Light Emitting Diodes -- 1.5.1 Device Structure of the Perovskite Light Emitting Diode -- 1.5.2 Physical Parameters of Perovskite Light‐Emitting Diodes -- 1.5.3 Device Performance Development of Perovskite Light‐Emitting Diodes -- 1.6 Summary -- References -- Chapter 2 Synthesis and Preparation of Perovskite Materials -- 2.1 Introduction -- 2.2 Perovskite Materials Structures -- 2.2.1 3D Halide Perovskite Materials for Light‐Emitting Diodes -- 2.2.2 Layered Halide Perovskite Materials -- 2.2.3 Halide Perovskite Quantum Dots/Nanocrystals -- 2.2.4 Commercial Prospects of Perovskite Materials -- 2.3 Preparation of Perovskite Nanomaterials -- 2.3.1 Mechanochemical Method -- 2.3.2 Ultrasonic Method -- 2.3.3 Microwave Method -- 2.3.4 Solvent Heat Method -- 2.3.5 Thermal Injection Method -- 2.3.6 Ligand‐Assisted Reprecipitation -- 2.3.7 Ion Exchange Method -- 2.3.8 Laser Etching Method -- 2.4 Processing Technology for Large‐Area Perovskite Films -- 2.4.1 Spin Coating Method -- 2.4.2 Vacuum Thermal Vapor Deposition Method -- 2.4.3 Printing Method -- 2.4.4 Vapor ‐Phase Deposition Method -- 2.4.5 Spraying Method -- 2.4.6 Template Method -- 2.4.7 Non‐Template Method. , 2.5 Conclusion and Outlook -- References -- Chapter 3 Near‐Infrared Perovskite Light‐Emitting Devices -- 3.1 Introduction -- 3.2 Progress in Near‐Infrared Perovskite Luminescence Materials -- 3.3 Near‐Infrared Perovskite Luminescent Materials -- 3.3.1 Methylamine Lead Iodide (MAPbI3) -- 3.3.2 NIR‐Emitting Materials Based on Perovskite -- 3.4 Strategies to Improve the Performance of NIR Perovskite Devices -- 3.4.1 NIR Perovskite Material Optimization -- 3.4.1.1 Near‐Infrared Wavelength Adjustment -- 3.4.1.2 Multiple Quantum Well Structure -- 3.4.1.3 Molecular Passivation -- 3.4.2 Device Structure Optimization -- 3.5 Conclusion and Outlook -- References -- Chapter 4 Perovskite Red Light‐Emitting Materials and Devices -- 4.1 The Development History of Perovskite Red Light‐Emitting Diodes -- 4.2 Red Emission Perovskite Materials -- 4.2.1 Typical Red Emission Perovskite Material CsPbI3 -- 4.2.2 Other Red Emission Perovskite Materials -- 4.2.2.1 Other ABX3 and Hybridized ABX3‐Type Materials -- 4.2.2.2 Double Perovskite -- 4.2.3 Red Emission Perovskite Synthesis -- 4.2.3.1 Synthesis of Nanocrystals -- 4.2.3.2 Synthesis of Quasi‐Two‐Dimensional Films -- 4.2.4 Optimization Strategies of Red Perovskite Materials -- 4.2.4.1 Doping -- 4.2.4.2 Surface Passivation -- 4.2.4.3 Multiple Quantum Well Structure -- 4.2.4.4 Ligand Engineering -- 4.2.4.5 Additive Engineering -- 4.3 Perovskite Red Light‐Emitting Diodes -- 4.3.1 Device Structure and Common Materials for Each Functional Layer -- 4.3.2 Device Optimization Strategy -- 4.3.2.1 Energy Level Regulation -- 4.3.2.2 Light Extraction Technology -- 4.3.2.3 Interface Treatment Method -- 4.4 Conclusion and Outlook -- References -- Chapter 5 Perovskite Green Light‐Emitting Materials and Devices -- 5.1 History of Green Perovskite Light‐Emitting Diodes -- 5.2 Green Light Perovskite Materials. , 5.2.1 Pure Inorganic Perovskite Materials -- 5.2.2 Organic-Inorganic Hybrid Perovskite Materials -- 5.2.3 Synthesis of Perovskite Green Light‐Emitting Materials -- 5.3 Development of Green Perovskite Light‐Emitting Diodes -- 5.3.1 Structure of Green Perovskite Light‐Emitting Diode Devices -- 5.3.2 Quantum Dot Green Perovskite Light‐Emitting Diodes -- 5.3.3 Nanocrystalline Green Perovskite Light‐Emitting Diodes -- 5.3.4 Quasi‐2D Ruddlesden-Popper Green Perovskite Light‐Emitting Diodes -- 5.4 Factors Affecting the External Quantum Efficiency of Perovskite Green Light‐Emitting Diodes -- 5.4.1 Aspects of Materials -- 5.4.2 Aspects of the Device Structure -- 5.5 Strategies for Improving the External Quantum Efficiency of Green Perovskite Light‐Emitting Diodes -- 5.5.1 Ligand Engineering -- 5.5.2 Crystal Engineering -- 5.5.3 Surface Engineering -- 5.5.4 Passivation Engineering -- 5.5.5 Optimization of the Device Structure -- 5.6 Other Properties of Green Perovskite Light‐Emitting Diodes -- 5.7 Conclusion and Outlook -- References -- Chapter 6 Blue Perovskite Light‐emitting Materials and Devices -- 6.1 Technology Development of Blue Perovskite Light‐emitting Diodes -- 6.2 Blueshift Strategy -- 6.3 Perovskite Blue Light‐emitting Materials -- 6.3.1 Perovskite Blue Light‐emitting Materials with a Quasi‐two‐dimensional Structure -- 6.3.1.1 Development of New Bulky Cations -- 6.3.1.2 Mixing of Bulky Cations -- 6.3.1.3 Cationic Doping -- 6.3.2 Blue Light Perovskite Nanocrystals or Quantum Dot Materials -- 6.4 Synthesis and Use of New Long‐Chain Ligands -- 6.5 Surface Modification of Nanostructures -- 6.6 Optimization of the Internal Structure -- 6.7 Process for the Preparation of Blue Light‐Emitting Layers -- 6.7.1 Preparation of Three‐Dimensional and Quasi‐Two‐Dimensional Perovskite Films -- 6.7.2 Preparation of Nano‐Microcrystalline Precursors. , 6.8 Device Performance Optimization and Interface Engineering -- 6.8.1 Passivation of Film Defects -- 6.8.2 Selection and Optimization of Hole and Electron Injection Layers -- 6.8.3 Interface Engineering -- 6.9 Optimization of Device Stability -- 6.9.1 Lifetime of Perovskite Blue Light‐emitting Diodes -- 6.9.2 Optimization of Efficiency Stability in Perovskite Light‐emitting Diodes -- 6.9.3 Light Color Stability Optimization -- 6.10 Conclusion and Outlook -- References -- Chapter 7 Effect of Metal Ion Doping on Perovskite Light‐Emitting Materials -- 7.1 Metal Ion Doping Effect -- 7.1.1 Effect of A‐site Metal Ion Doping on Perovskite Materials -- 7.1.2 Effect of B‐site Metal Ion Doping on Perovskite Materials -- 7.2 Metal Ion‐Doped Materials and Devices -- 7.2.1 Near‐infrared Optical Perovskite Materials -- 7.2.2 Red Light Perovskite Materials -- 7.2.3 Green Light Perovskite Materials -- 7.2.4 Blue‐Light Perovskite Materials -- 7.3 Metal Ion Doping Methods -- 7.3.1 Post‐synthesis Ion Exchange Methods -- 7.3.2 Colloidal Synthesis Methods -- 7.3.3 The Thermal Injection Methods -- 7.3.4 High Temperature Solid‐state Synthesis Methods -- 7.4 Conclusion and Outlook -- References -- Chapter 8 Non‐lead Metal Halide Perovskite Materials -- 8.1 Development History of Non‐lead Blue Perovskite Materials -- 8.2 Preparation of Non‐lead Metal Halide Materials -- 8.3 Types of Non‐lead Metal Halide Materials -- 8.3.1 Tin‐Based Perovskites Materials -- 8.3.2 Bismuth‐Based Metal Halide Materials -- 8.3.3 Antimony‐Based Metal Halide Materials -- 8.3.4 Copper‐Based Metal Halide Materials -- 8.3.5 Europium‐Based Metal Halide Materials -- 8.3.6 Bimetallic Cationic Halide Perovskites Materials -- 8.4 Methods for Optimizing the Fluorescence Quantum Efficiency of Non‐lead Metal Halide Materials -- 8.4.1 Surface Passivation. , 8.4.2 Selection of Solvents and Undesirable Solvents -- 8.4.3 Doping -- 8.5 Conclusion and Outlook -- References -- Chapter 9 Perovskite White Light‐emitting Materials and Devices -- 9.1 Background of WPeLED -- 9.2 Down‐conversion Method -- 9.3 Full Electroluminescent PeLEDs -- 9.3.1 Yellow Perovskite Light‐emitting Diodes -- 9.3.1.1 Zero‐dimensional Sn‐doped Halide Perovskites -- 9.3.1.2 2D (C18H35NH3)2SnBr4 Perovskite -- 9.3.1.3 Colloidal Undoped and Double‐doped Cs2AgInCl6 Nanocrystals -- 9.3.1.4 Introducing Separated Emitting Centers -- 9.3.2 Progress in the Research of Sky‐Blue Perovskite Light‐emitting Diodes -- 9.4 Single White Light Perovskite Materials and Self‐trapped Excitons -- 9.4.1 Single White Light Perovskite Materials -- 9.4.1.1 (110) Perovskite with Corrugated Inorganic Layers -- 9.4.1.2 (001) Perovskite with Flat Inorganic Layers -- 9.4.2 Self‐trapped Excitons -- 9.5 Perovskite-Organic Coupling White PeLEDs -- 9.6 Others -- 9.7 Conclusion and Outlook -- References -- Chapter 10 Electron and Hole Transport Materials -- 10.1 Background of Charge Transport Materials -- 10.1.1 Charge Transport of Metal Halide Perovskite Materials -- 10.1.2 Charge Transport Materials in PeLED -- 10.2 Electron Transport Materials in PeLEDs -- 10.2.1 Inorganic Oxides Electron Transport Materials -- 10.2.2 Inorganically Doped Electron Transport Materials -- 10.2.3 Organic Monolayer Electron Transport Materials -- 10.2.4 Organic Multilayer Electron Transport Materials -- 10.2.5 Doped Organic Electron Transport Materials -- 10.2.6 Organic-Inorganic Hybrid Electron Transport Materials -- 10.3 Hole Transport Materials in PeLEDs -- 10.4 Progress in the Study of Hole Transport Layers and Hole Injection Layers in Perovskite Light Emitting Diodes -- 10.4.1 PVK‐Doped TPD, TCTA -- 10.4.2 PEDOT:PSS After Methanol Treatment -- 10.4.3 TB(MA) Instead of PEDOT:PSS. , 10.4.4 PSS‐Doped Na.
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  • 3
    Electronic Resource
    Electronic Resource
    Self-assembled monolayer organic field-effect transistors (2001)
    [s.l.] : Macmillian Magazines Ltd.
    Nature 413 (2001), S. 713-716 
    Details
    ISSN: 1476-4687
    Source: Nature Archives 1869 - 2009
    Topics: Biology , Chemistry and Pharmacology , Medicine , Natural Sciences in General , Physics
    Notes: [Auszug] The use of individual molecules as functional electronic devices was proposed in 1974 (ref. 1). Since then, advances in the field of nanotechnology have led to the fabrication of various molecule devices and devices based on monolayer arrays of molecules. Single molecule devices are ...
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1038/413713a0
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  • 4
    Electronic Resource
    Electronic Resource
    Mast cells are potent regulators of endothelial cell adhesion molecule ICAM-1 and VCAM-1 expression (1995)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Cellular Physiology 165 (1995), S. 40-53 
    Details
    ISSN: 0021-9541
    Keywords: Life and Medical Sciences ; Cell & Developmental Biology
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Biology , Medicine
    Notes: To investigate the possible role of mast cells (MC) in regulating leukocyte adhesion to vascular endothelial cells (EC), microvascular and macrovascular EC were exposed to activated MC or MC conditioned medium (MCCM). Expression of intercellular and vascular adhesion molecules (ICAM-1 and VCAM-1) on EC was monitored. Incubation of human dermal microvascular endothelial cells (HDMEC) and human umbilical vein endothelial cells (HUVEC) with activated MC or MCCM markedly increased ICAM-1 and VCAM-1 surface expression, noted as éarly as 4 hr. Maximal levels were observed at 16 hr followed by a general decline over 48 hr. A dose-dependent response was noted using incremental dilutions of MCCM or by varying the number of MC in coculture with EC. At a ratio as low as 1:1,000 of MC:EC, increased ICAM-1 was observed. The ICAM-1 upregulation by MCCM was 〉90% neutralized by antibody to tumor necrosis factor alpha (TNF-α), suggesting that MC release of this cytokine contributes significantly to inducing EC adhesiveness. VCAM-1 expression enhanced by MCCM was partly neutralized (70%) by antibody to TNF-α; thus other substances released by MC may contribute to VCAM-1 expression. Northern blot analysis demonstrated MCCM upregulated ICAM-1 and VCAM-1 mRNA in both HDMEC and HUVEC. To evaluate the function of MCCM-enhanced EC adhesion molecules, T cells isolated from normal human donors were used in a cell adhesion assay. T-cell binding to EC was increased significantly after exposure of EC to MCCM, and inhibited by antibodies to ICAM-1 or VCAM-1. Intradermal injection of allergen in human atopic volunteers known to develop late-phase allergic reactions led to marked expression of both ICAM-1 and VCAM-1 at 6 hr, as demonstrated by immunohistochemistry. These studies indicate that MC play a critical role in regulating the expression of EC adhesion molecules, ICAM-1 and VCAM-1, and thus augment inflammatory responses by upregulating leukocyte binding. © 1995 Wiley-Liss Inc.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/jcp.1041650106
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  • 5
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    The effects of vitamins C and B12 on human nasal ciliary beat frequency (2013)
    BioMed Central
    Details
    Publication Date: 2013-05-21
    Description: Background: This study was designed to investigate the effects of the vitamins C and B12 on the regulation of human nasal ciliary beat frequency (CBF). Methods: Human nasal mucosa was removed endoscopically and nasal ciliated cell culture was established. Changes of CBF in response to different concentrations of vitamin C or vitamin B12 were quantified by using high-speed (240 frames per second) digital microscopy combined with a beat-by-beat CBF analysis. Results: At the concentrations of 0.01% and 0.10%, vitamin C induced an initial increase, followed by a gradual decrease of CBF to the baseline level, while 1.00% vitamin C induced a reversible decrease of CBF. Vitamin B12, at the concentrations of 0.01% and 0.10%, did not influence CBF during the 20-min observation period, while a 1.00% vitamin B12 treatment caused a time-dependent but reversible decrease of CBF. Conclusions: Treatment with vitamin C or vitamin B12 caused a concentration-dependent but reversible decrease of CBF in cultured human nasal epithelial cells. Therefore, it is necessary to choose a concentration that is safe, effective, and non-ciliotoxic when applying these drugs topically in the nasal cavity.
    Electronic ISSN: 1472-6882
    Topics: Medicine
    Published by BioMed Central
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  • 6
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    Genetic Variability and Phylogenetic Analysis of Han Population from Guanzhong Region of China based on 21 non-CODIS STR Loci (2015)
    Nature Publishing Group (NPG)
    Details
    Publication Date: 2015-03-10
    Description: In the present study, we presented the population genetic data and their forensic parameters of 21 non-CODIS autosomal STR loci in Chinese Guanzhong Han population. A total of 166 alleles were observed with corresponding allelic frequencies ranging from 0.0018 to 0.5564. No STR locus was observed to deviate from the Hardy-Weinberg equilibrium and linkage disequilibriums after applying Bonferroni correction. The cumulative power of discrimination and probability of exclusion of all the 21 STR loci were 0.99999999999999999993814 and 0.999998184, respectively. The results of genetic distances, phylogenetic trees and principal component analysis revealed that the Guanzhong Han population had a closer relationship with Ningxia Han, Tujia and Bai groups than other populations tested. In summary, these 21 STR loci showed a high level of genetic polymorphisms for the Guanzhong Han population and could be used for forensic applications and the studies of population genetics. Scientific Reports 5 doi: 10.1038/srep08872
    Electronic ISSN: 2045-2322
    Topics: Natural Sciences in General
    Published by Nature Publishing Group (NPG)
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  • 7
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    Controllable Hysteresis and Threshold Voltage of Single-Walled Carbon Nano-tube Transistors with Ferroelectric Polymer Top-Gate Insulators (2016)
    Nature Publishing Group (NPG)
    Details
    Publication Date: 2016-03-17
    Description: Controllable Hysteresis and Threshold Voltage of Single-Walled Carbon Nano-tube Transistors with Ferroelectric Polymer Top-Gate Insulators Scientific Reports, Published online: 16 March 2016; doi:10.1038/srep23090
    Electronic ISSN: 2045-2322
    Topics: Natural Sciences in General
    Published by Nature Publishing Group (NPG)
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  • 8
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    Snail modulates the assembly of fibronectin via α5 integrin for myocardial migration in zebrafish embryos (2014)
    Nature Publishing Group (NPG)
    Details
    Publication Date: 2014-03-27
    Description: The Snail family member snail encodes a zinc finger-containing transcriptional factor that is involved in heart formation. Yet, little is known about how Snail regulates heart development. Here, we identified that one of the duplicated snail genes, snai1b, was expressed in the heart region of zebrafish embryos. Depletion of Snai1b function dramatically reduced expression of α5 integrin, disrupted Fibronectin layer in the heart region, especially at the midline, and prevented migration of cardiac precursors, resulting in defects in cardiac morphology and function in zebrafish embryos. Injection of α5β1 protein rescued the Fibronectin layer and then the myocardial precursor migration in snai1b knockdown embryos. The results provide the molecular mechanism how Snail controls the morphogenesis of heart during embryonic development. Scientific Reports 4 doi: 10.1038/srep04470
    Electronic ISSN: 2045-2322
    Topics: Natural Sciences in General
    Published by Nature Publishing Group (NPG)
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  • 9
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    Endoscopic Submucosal Tunnel Dissection for Large Gastric Neoplastic Lesions: A Case-Matched Controlled Study (2018)
    Hindawi
    Details
    Publication Date: 2018-03-06
    Description: Aim. To evaluate the efficacy and safety of endoscopic submucosal tunnel dissection (ESTD) for resection of large superficial gastric lesions (SGLs). Methods. The clinicopathological records of patients performed with ESTD or endoscopic submucosal dissection (ESD) for SGLs between January 2012 and January 2014 were retrospectively reviewed. 7 cases undergoing ESTD were enrolled to form the ESTD group. The cases were individually matched at a 1 : 1 ratio to other patients performed with ESD according to lesion location, ulcer or scar findings, resected specimen area, operation time and operators, and the matched cases constituting the ESD group. The treatment outcomes were compared between the two groups. Results. The mean specimen size was 46 mm. 10 lesions were located in the cardia and 4 lesions in the lesser curvature of the lower gastric body. En bloc resection was achieved for all lesions. The mean ESTD resection time was 69 minutes as against 87.7 minutes for the ESD (). The mean resection speed was faster for ESTD than for ESD (18.86 mm2/min versus 13.76 mm2/min, ). There were no significant differences regarding the safety and curability during the endoscopic follow-up (mean 27 months). Conclusions. ESTD is effective and safe for the removal of SGLs and appears to be an optimal option for patients with large SGLs at suitable sites.
    Print ISSN: 1687-6121
    Electronic ISSN: 1687-630X
    Topics: Medicine
    Published by Hindawi
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    A pri-miR-218 variant and risk of cervical carcinoma in Chinese women (2013)
    BioMed Central
    Details
    Publication Date: 2013-01-16
    Description: Background: MicroRNA (miRNA)-related single nucleotide polymorphisms (SNPs) may compromise miRNA binding affinity and modify mRNA expression levels of the target genes, thus leading to cancer susceptibility. However, few studies have investigated roles of miRNA-related SNPs in the etiology of cervical carcinoma. Methods: In this case-control study of 1,584 cervical cancer cases and 1,394 cancer-free female controls, we investigated associations between two miR-218-related SNPs involved in the LAMB3-miR-218 pathway and the risk of cervical carcinoma in Eastern Chinese women. Results: We found that the pri-miR-218 rs11134527 variant GG genotype was significantly associated with a decreased risk of cervical carcinoma compared with AA/AG genotypes (adjusted OR=0.77, 95% CI=0.63-0.95, P=0.015). However, this association was not observed for the miR-218 binding site SNP (rs2566) on LAMB3. Using the multifactor dimensionality reduction analysis, we observed some evidence of interactions of these two SNPs with other risk factors, especially age at primiparity and menopausal status, in the risk of cervical carcinoma. Conclusions: The pri-miR-218 rs11134527 SNP was significantly associated with the risk of cervical carcinoma in Eastern Chinese women. Larger, independent studies are warranted to validate our findings.
    Electronic ISSN: 1471-2407
    Topics: Medicine
    Published by BioMed Central
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