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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 4065-4073 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Dislocations have been made to move through different compound semiconductor epilayer structures by deformation at 320 °C and have then been examined by transmission electron microscopy. The interaction between the dislocations and the GaAs/AlxGa1−xAs interface is shown to depend on the thickness of the AlxGa1−xAs layer. Dislocations are pinned at the interface and, for the MOCVD-grown material, within the AlxGa1−xAs layer. Dislocation dipoles, some of which are faulted dipoles, are then pulled out and lie preferentially along the heterojunction. It is emphasized that these dipoles, which may be important in device degradation, form as a result of dislocation glide and not dislocation climb.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 66 (1989), S. 4723-4728 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Implantation defects under a mask edge were studied by cross-sectional transmission electron microscopy. An arsenic implantation with a dose of 5×1015 cm−2 as used for source/drain implantations in metal-oxide-semiconductor transistor structures completely amorphizes a 63-nm-thick silicon surface layer and produces a sharply curved amorphous/crystalline interface under the mask edge. Annealing at 900 °C results in the formation of vacancy-type dislocation half-loops or microtwinning on {111} planes under the mask edge. Partial crystallization of the amorphous layer at 500 °C revealed a notch in the amorphous/crystalline interface which is shown to be due to the different epitaxial regrowth rates on the various lattice planes. On further annealing, the above-mentioned defects are generated when the crystallization fronts on both sides of the notch join.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Journal of Crystal Growth 71 (1985), S. 514-518 
    ISSN: 0022-0248
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology , Geosciences , Physics
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 36 (1985), S. 1-13 
    ISSN: 1432-0630
    Keywords: 78.55.-m ; 78.55.Ds ; 71.55.Fr
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Photoluminescence is studied in silicon, deformed in a well-defined and reproducible way. Usual deformation conditions (high temperature, low stress) result in sharp spectra of the D1 through D4 lines as recently described in the literature. New lines D5 and D6 emerge for predeformation as above and subsequent low-temperature, high-stress deformation. Another new sharp line, D12, is observed when both the familiar and the novel lines appear simultaneously. Annealing for 1 h atT A≳ 300 °C causes all new lines to disappear and the D1–D4 spectra to reappear. Quantitative annealing and TEM micrographs suggest that D5 is related to straight dislocations and D6 to stacking faults, whereas D1–D4 are due to relaxed dislocations. Photoluminescence under uniaxial stress shows that D1/D2 originate in tetragonal defects with random orientation relative to 〈100〉 directions, whereas D6 stems from triclinic centers, preferentially oriented — as are the D3/D4 centers. We conclude that the D3/D4 and the D5 and D6 defects are closely related, whereas the independent D1/D2 centers might be deformation-produced point defects in the strain region of dislocations.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    New York, NY : Wiley-Blackwell
    Journal of Electron Microscopy Technique 2 (1985), S. 533-546 
    ISSN: 0741-0581
    Keywords: Reflection electron microscopy (REM) ; Cross-sections ; Interfaces ; Life and Medical Sciences ; Cell & Developmental Biology
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Natural Sciences in General
    Notes: Reflection electron microscopy (REM) is shown to be applicable to the testing of the quality of AlxGa1-xAs/GaAs layer structures. Cross-sectional images of quantum well structures with layer thickness down to 1 nm can be obtained. The practical aspects of the REM technique are presented. The most important advantages and drawbacks of cross-sectional REM are discussed in detail.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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