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  • 1
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of the New York Academy of Sciences 273 (1976), S. 0 
    ISSN: 1749-6632
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Natural Sciences in General
    Type of Medium: Electronic Resource
    Location Call Number Limitation Availability
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Rheologica acta 35 (1996), S. 458-469 
    ISSN: 1435-1528
    Keywords: Interfacial tension ; high viscosity ; high molecular weight ; large viscosity ratios ; poly(methyl methacrylate) ; polystyrene ; imbedded disk
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: Abstract A method for measuring interfacial tension of high viscosity polymer melts at elevated temperatures is described. The method involves the tracking of the shape evolution of a disk of one material imbedded in a second one. This makes it possible to determine the interfacial tension over a relatively short time period. The technique of preparing the samples makes it possible to measure on practically any combination of polymer melts without restrictions on viscosities and melting temperature, as long as one of the materials is transparent in the molten state. The retraction of the disk is observed by using a microscope with a high resolution video camera. The camera is connected to a video frame grabber in a personal computer which is programmed to collect images with preselected time intervals. Data of the retraction is acquired by using an image analysis software, measuring the average radius of the disk. The driving force for the shape evolution is interfacial tension and it is balanced by viscous forces. The analysis of the retraction process is done analytically with a simplified one-dimensional model. The model has been compared to experiments with the system PS/PMMA at 210 °C, covering viscosity ratios over a range of six decades and five different molecular weight values of PS. It is shown that interfacial tension can be determined over the whole range and a value of 1.1±0.2 mN/m was obtained for all samples.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 317-321 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Sample size sensitivity of thermal gravimetric analysis (TGA) presents a serious handicap in the obtaining of reliable thermal stability data for high-temperature applications. For example, predictions of the apparent time for degradation during an isothermal experiment based on the results obtained using a 10 μm thick specimen can be off by an order of magnitude when applied to a product with a thickness of 10 cm. To address this effect, TGA experiments studying the thermal degradation of poly(methyl methacrylate) were conducted. Analysis of the experimental data resulted in the development of a relationship between the apparent time scale of the thermal degradation and the specimen thickness. Origins of the new dependence were traced to the change of the diffusivity resulting from material volatilization. Implications of the coupling between these two events for the analysis of thermal stability for new polymeric materials are discussed, and required changes in the current methodology are outlined.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    Location Call Number Limitation Availability
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  • 4
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 31 (1991), S. 1337-1343 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: In this paper, we analyze the basic physics of residual stress development during cooling of thermoplastic composite matrix materials. The analytical model presented here examines development of the stress field during cooling off a cylinder of thermoplastic matrix material. The residual stress field predicted by the model is compared to observations of the differences in microstructure of polymeric materials with different processing histories. The results of the investigation indicate that changes in the matrix related to processing conditions can contribute to damage formation in composites.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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