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  • 1
    In: Journal of Applied Physics, AIP Publishing, Vol. 123, No. 16 ( 2018-04-28)
    Abstract: The defect properties of InGaAsN dilute nitrides grown as sub-monolayer digital alloys (SDAs) by molecular beam epitaxy for photovoltaic application were studied by space charge capacitance spectroscopy. Alloys of i-InGaAsN (Eg = 1.03 eV) were lattice-matched grown on GaAs wafers as a superlattice of InAs/GaAsN with one monolayer of InAs ( & lt;0.5 nm) between wide GaAsN (7–12 nm) layers as active layers in single-junction solar cells. Low p-type background doping was demonstrated at room temperature in samples with InGaAsN layers 900 nm and 1200 nm thick (less 1 × 1015 cm−3). According to admittance spectroscopy and deep-level transient spectroscopy measurements, the SDA approach leads to defect-free growth up to a thickness of 900 nm. An increase in thickness to 1200 nm leads to the formation of non-radiative recombination centers with an activation energy of 0.5 eV (NT = 8.4 × 1014 cm−3) and a shallow defect level at 0.20 eV. The last one leads to the appearance of additional doping, but its concentration is low (NT = 5 × 1014 cm−3) so it does not affect the photoelectric properties. However, further increase in thickness to 1600 nm, leads to significant growth of its concentration to (3–5) × 1015 cm−3, while the concentration of deep levels becomes 1.3 × 1015 cm−3. Therefore, additional free charge carriers appearing due to ionization of the shallow level change the band diagram from p-i-n to p-n junction at room temperature. It leads to a drop of the external quantum efficiency due to the effect of pulling electric field decrease in the p-n junction and an increased number of non-radiative recombination centers that negatively impact lifetimes in InGaAsN.
    Type of Medium: Online Resource
    ISSN: 0021-8979 , 1089-7550
    Language: English
    Publisher: AIP Publishing
    Publication Date: 2018
    detail.hit.zdb_id: 220641-9
    detail.hit.zdb_id: 3112-4
    detail.hit.zdb_id: 1476463-5
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  • 2
    In: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, American Vacuum Society, Vol. 36, No. 2 ( 2018-03-01)
    Abstract: A plasma technology approach to grow microcrystalline GaP/Si superlattices was explored. The layers of GaP were grown using time modulated plasma enhanced deposition (atomic layer deposition approach), while Si layers were grown using the conventional plasma enhanced chemical vapor deposition mode with high hydrogen dilution. The (3 nm)GaP/(2 nm)Si superlattices were formed on Si and GaP substrates either by the growth of an amorphous GaP/Si multilayer structure followed by thermal annealing at 450–900 °C or by growth of a microcrystalline GaP/Si superlattice at temperatures not exceeding 400 °C. A quantum confinement effect of thin 2 nm Si layers was demonstrated by the appearance of a peak at 500 cm−1 in Raman spectra. The crucial role of hydrogen behavior in Si crystallization and void formation during the annealing of amorphous and growth of microcrystalline GaP/Si structures was demonstrated.
    Type of Medium: Online Resource
    ISSN: 0734-2101 , 1520-8559
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 2018
    detail.hit.zdb_id: 1475424-1
    detail.hit.zdb_id: 797704-9
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  • 3
    In: physica status solidi (a), Wiley, Vol. 214, No. 12 ( 2017-12)
    Abstract: An attractive method of low‐temperature plasma‐enhanced atomic layer deposition (PE‐ALD) of GaP on silicon wafer was recently proposed. In the present paper, the influence of the growth process on the quality of silicon wafers is explored by space charge capacitance techniques, C–V profiling and deep level transient spectroscopy (DLTS). No DLTS peak is observed for PE‐ALD GaP deposited onto n‐type wafer, meaning that the defect concentration is very low (less than 1 × 10 12  cm −3 ) and that the growth process does not affect the properties of the n‐Si wafer. For boron‐doped p‐type silicon, C–V profiling shows that there is no deactivation of boron doping after the PE‐ALD process, as could have been expected from the presence of hydrogen in the plasma. Measurements on the reference Schottky diodes formed on the p‐type Si wafer reveal the presence of the well‐known Fe interstitial defects at the position E V  + 0.38 eV with a concentration of 3 × 10 13  cm −3 . PE‐ALD of GaP leads to a modification of the response of this defect and to the appearance of another response in the low temperature range, possibly related to changes in the Fe interstitial defect environment or configuration. However, deep‐levels were not detected in p‐Si after PE‐ALD, meaning that the quality of p‐Si does not degrade.
    Type of Medium: Online Resource
    ISSN: 1862-6300 , 1862-6319
    URL: Issue
    Language: English
    Publisher: Wiley
    Publication Date: 2017
    detail.hit.zdb_id: 1481091-8
    detail.hit.zdb_id: 208850-2
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  • 4
    In: physica status solidi (a), Wiley, Vol. 216, No. 10 ( 2019-05)
    Abstract: The properties of n‐GaP/p‐Si interface as well as their influence on solar cell performance are studied for GaP layers grown by low‐temperature (380 °C) plasma‐enhanced atomic layer deposition (PE‐ALD). The influence of different plasma treatments and RF power values are explored. The increase of RF power leads to a growth transition from amorphous (a‐GaP) to microcrystalline GaP (μc‐GaP) with either amorphous‐GaP/Si or epitaxial‐GaP/Si interface, respectively. However, when continuous hydrogen plasma is used the amorphous‐GaP/Si interface exhibits better photovoltaic performance compared to the epitaxial one. Values of open circuit voltage, V oc  = 0.45–0.55 V and internal quantum efficiencies, IQE  〉  0.9 are obtained for amorphous‐GaP/Si interfaces compared to V oc  = 0.25–0.35 V and IQE  〈  0.45 for epitaxial‐GaP/Si interfaces. According to admittance spectroscopy and TEM studies the near‐surface (30–50 nm) area of the Si substrate is damaged during growth with high RF power of hydrogen plasma. A hole trap at the level of E V  + (0.33 ± 0.02) eV is detected by admittance spectroscopy in this damaged Si area. The damage of Si is not observed by TEM when the deposition of the structures with epitaxial‐GaP/Si interface is realized by a modified process without hydrogen plasma indicating that the damage of the near‐surface area of Si is related to hydrogen plasma interaction.
    Type of Medium: Online Resource
    ISSN: 1862-6300 , 1862-6319
    URL: Issue
    Language: English
    Publisher: Wiley
    Publication Date: 2019
    detail.hit.zdb_id: 1481091-8
    detail.hit.zdb_id: 208850-2
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