In:
Chinese Journal of Lasers, Shanghai Institute of Optics and Fine Mechanics, Vol. 50, No. 4 ( 2023), p. 0402007-
Type of Medium:
Online Resource
ISSN:
0258-7025
Uniform Title:
Microstructure and Mechanism of Copper Layer Processed with Laser Remelting and Electrochemical Deposition Interaction Process
DOI:
10.3788/CJL/2023/50/4
Language:
English
,
Chinese
Publisher:
Shanghai Institute of Optics and Fine Mechanics
Publication Date:
2023
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