In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 52, No. 5S3 ( 2013-05-01), p. 05FD01-
Abstract:
Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.7567/JJAP.52.05FD01
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2013
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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