In:
Applied Optics, Optica Publishing Group, Vol. 59, No. 2 ( 2020-01-10), p. 459-
Abstract:
A void-free bonding technique was demonstrated for a large slab Nd: YAG crystal with a bonding surface dimension of ∼ 160 m m × 70 m m . By using the novel fluxless oxide layer removal technology, the indium-oxide barrier problem was resolved. With the help of electrochemical-polished indium solder and a plasma-cleaned heat sink, the solderability of the indium was enhanced; in particular, the contact angle of the solder was improved from 51° to 31°. With the largest-bonding-size slab, a single-slab laser created a maximum output power of 7.3 kW under an absorbed pump power of 12.8 kW, corresponding to an optical to optical efficiency of 57% and a slope conversion of 67.8%. By detecting the wavefront of the interferometer before and after bonding, the RMS of wavefront was 0.192 λ and 0.434 λ ( λ = 633 n m ), respectively. To the best of our knowledge, this is the largest void-free bonding size for a laser slab and the highest output power achieved from a single-slab crystal laser oscillator.
Type of Medium:
Online Resource
ISSN:
1559-128X
,
2155-3165
DOI:
10.1364/AO.59.000459
Language:
English
Publisher:
Optica Publishing Group
Publication Date:
2020
detail.hit.zdb_id:
207387-0
detail.hit.zdb_id:
1474462-4
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