In:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 25, No. 1 ( 2007-01-01), p. 271-276
Abstract:
A new process technology for the wafer-level fabrication of surface acoustic wave (SAW) structures in piezoelectric LiNbO3 is reported. The complete Cu-based metallization system is embedded in the surface by applying the damascene technology. This technique includes ion based dry etching procedures, metallization by sputter deposition (physical vapor deposition) and electrochemical deposition, and finally planarization by chemical-mechanical polishing. The process steps were monitored by means of different evaluation techniques. SAW wave field measurements provided evidence for a good surface quality after planarization.
Type of Medium:
Online Resource
ISSN:
1071-1023
,
1520-8567
Language:
English
Publisher:
American Vacuum Society
Publication Date:
2007
detail.hit.zdb_id:
3117331-7
detail.hit.zdb_id:
3117333-0
detail.hit.zdb_id:
1475429-0
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