In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 44, No. 1R ( 2005-01-01), p. 82-
Abstract:
A slurry containing Benzotriazole (BTA) as the inhibitor was analyzed in terms of its frictional, thermal and kinetic attributes for copper CMP applications. The frictional analysis indicated that `boundary lubrication' was the dominant tribological mechanism. Due to the presence of the inhibitor in the slurry, copper removal rate exhibited a highly non-Prestonian behavior. Based on the measured coefficient of friction ( COF ) and pad temperature data, a proven thermal model was used to predict wafer temperature. The Preston Equation was used to describe the polishing rate when p × V was lower than 11,000 Pa·m/s; while a modified Langmuir–Hinshelwood kinetic model was used to simulate the copper removal when p × V was higher than 11,555 Pa·m/s. Assuming that the adsorbed inhibitor layer was abraded off instantly from the copper surface when p × V was higher than 11,555 Pa·m/s, the modified Langmuir–Hinshelwood kinetic model indicated that copper polishing was chemically limited in this polishing region.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2005
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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