In:
Frontiers in Materials, Frontiers Media SA, Vol. 8 ( 2021-6-17)
Abstract:
Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu 11 In 9 was formed and gradually transformed to Cu 2 In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu 11 In 9 to Cu 2 In. When bonding temperature increased to 320°C, only Cu 2 In was detected and then gradually transformed to Cu 7 In 3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu 2 In to Cu 7 In 3 .
Type of Medium:
Online Resource
ISSN:
2296-8016
DOI:
10.3389/fmats.2021.658464
Language:
Unknown
Publisher:
Frontiers Media SA
Publication Date:
2021
detail.hit.zdb_id:
2759394-0
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