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  • 1
    Online Resource
    Online Resource
    Pharmacogenetic Discovery in CALGB (Alliance) 90401 and Mechanistic Validation of a VAC14 Polymorphism that Increases Risk of Docetaxel-Induced Neuropathy
    American Association for Cancer Research (AACR) ; 2016
    In:  Clinical Cancer Research Vol. 22, No. 19 ( 2016-10-01), p. 4890-4900
    Details
    In: Clinical Cancer Research, American Association for Cancer Research (AACR), Vol. 22, No. 19 ( 2016-10-01), p. 4890-4900
    Abstract: Purpose: Discovery of SNPs that predict a patient's risk of docetaxel-induced neuropathy would enable treatment individualization to maximize efficacy and avoid unnecessary toxicity. The objectives of this analysis were to discover SNPs associated with docetaxel-induced neuropathy and mechanistically validate these associations in preclinical models of drug-induced neuropathy. Experimental Design: A genome-wide association study was conducted in metastatic castrate-resistant prostate cancer patients treated with docetaxel, prednisone and randomized to bevacizumab or placebo on CALGB 90401. SNPs were genotyped on the Illumina HumanHap610-Quad platform followed by rigorous quality control. The inference was conducted on the cumulative dose at occurrence of grade 3+ sensory neuropathy using a cause-specific hazard model that accounted for early treatment discontinuation. Genes with SNPs significantly associated with neuropathy were knocked down in cellular and mouse models of drug-induced neuropathy. Results: A total of 498,081 SNPs were analyzed in 623 Caucasian patients, 50 (8%) of whom experienced grade 3+ neuropathy. The 1,000 SNPs most associated with neuropathy clustered in relevant pathways including neuropathic pain and axonal guidance. An SNP in VAC14 (rs875858) surpassed genome-wide significance (P = 2.12 × 10−8, adjusted P = 5.88 × 10−7). siRNA knockdown of VAC14 in stem cell–derived peripheral neuronal cells increased docetaxel sensitivity as measured by decreased neurite processes (P = 0.0015) and branches (P & lt; 0.0001). Prior to docetaxel treatment, VAC14 heterozygous mice had greater nociceptive sensitivity than wild-type litter mate controls (P = 0.001). Conclusions: VAC14 should be prioritized for further validation of its potential role as a predictor of docetaxel-induced neuropathy and biomarker for treatment individualization. Clin Cancer Res; 22(19); 4890–900. ©2016 AACR.
    Type of Medium: Online Resource
    ISSN: 1078-0432 , 1557-3265
    URL: Article
    DOI: 10.1158/1078-0432.CCR-15-2823
    RVK:
    XA 36791
    Language: English
    Publisher: American Association for Cancer Research (AACR)
    Publication Date: 2016
    detail.hit.zdb_id: 1225457-5
    detail.hit.zdb_id: 2036787-9
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    Online Resource
  • 2
    Online Resource
    Online Resource
    Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics
    IMAPS - International Microelectronics Assembly and Packaging Society ; 2017
    In:  Journal of Microelectronics and Electronic Packaging Vol. 14, No. 4 ( 2017-10-01), p. 132-139
    Details
    In: Journal of Microelectronics and Electronic Packaging, IMAPS - International Microelectronics Assembly and Packaging Society, Vol. 14, No. 4 ( 2017-10-01), p. 132-139
    Abstract: Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heat-affected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an inert or reducing gas shroud is applied around the laser spot to shield the HAZ from ambient oxygen. With the shroud gas-shielded laser, oxygen-sensitive nanoparticles, such as those made of copper and nickel, can be successfully sintered in open air. With very short heating time and small HAZ, the localized peak sintering temperature can be substantially higher than that of damage threshold for the underlying substrate, for effective metallization of nanoparticle inks. Here, we demonstrate capabilities for producing conductive tracks of silver, copper, and copper–nickel alloys on flexible films as well as fabricating functional thermocouples and strain gauge sensors, with printed metal nanoparticle inks sintered by shroud-gas-shielded laser.
    Type of Medium: Online Resource
    ISSN: 1551-4897
    URL: Article
    DOI: 10.4071/imaps.521797
    Language: English
    Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
    Publication Date: 2017
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    Online Resource
  • 3
    Online Resource
    Online Resource
    Aerosol Jet® Enabled 3D Antenna and Sensors for IoT Applications
    IMAPS - International Microelectronics Assembly and Packaging Society ; 2015
    In:  International Symposium on Microelectronics Vol. 2015, No. 1 ( 2015-10-01), p. 000203-000209
    Details
    In: International Symposium on Microelectronics, IMAPS - International Microelectronics Assembly and Packaging Society, Vol. 2015, No. 1 ( 2015-10-01), p. 000203-000209
    Abstract: There is fast growing demand for antennas and sensors directly integrated into products including smartphones, wearables, structural components, and other products related to the Internet of Things (IoT). While IoT applications are varied, the common requirement for such “Smart Connected Devices” is an inherent need for sensors (“smart”) and antennas (“connected”). Emerging 3-Dimensional “Direct Write” approaches for creating antenna and sensors enable rapid design and prototyping, reduce manufacturing steps and associated costs, and broaden the choice of target substrate shapes and materials. Optomec has developed a high volume printing solution for the production of 3D antenna and 3D sensors that are tightly integrated with an underlying product ranging from Smartphones to Industrial Components. Aerosol Jet® is a non-contact, room temperature deposition method that is used to print a wide variety of materials, including conductive, semiconducting, ceramic, CNT, graphene and other functional inks suitable for the fabrication of antenna and sensor that are directly integrated onto existing 3D products and structures. Case studies involving direct printing of various antenna (ie: Broadband, Bluetooth, NFC, etc) and sensors (ie: Strain, Creep, etc.) will be presented. Material considerations, including performance and reliability metrics will be discussed; and examples of via filling, wrap-around printing, and five axis motion will be shown.
    Type of Medium: Online Resource
    ISSN: 2380-4505
    URL: Article
    DOI: 10.4071/isom-2015-WA14
    Language: English
    Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
    Publication Date: 2015
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    Online Resource
  • 4
    Online Resource
    Online Resource
    Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
    IMAPS - International Microelectronics Assembly and Packaging Society ; 2011
    In:  Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) Vol. 2011, No. DPC ( 2011-01-01), p. 001250-001268
    Details
    In: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), IMAPS - International Microelectronics Assembly and Packaging Society, Vol. 2011, No. DPC ( 2011-01-01), p. 001250-001268
    Abstract: Optomec's Aerosol Jet print platform provides an evolutionary alternative to both wire bond and TSV technology, providing high density 3-dimensional interconnect capabilities which enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance System-in-Package (SiP) solutions. The die stacks can include 8 or more die, with a total stack height of ~ 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than 15,000 interconnects per hour. The Aerosol Jet deposits silver nanoparticle ink connections on staggered multi-chip die stacks. High aspect ratio interconnects with & lt;30-micron line width and 6-micron line heights have been demonstrated at sub 60-micron pitches with resistivity & lt;1x10−7 ohm*m. Pre-production yields exceeding 80% have been consistently realized. This paper will be further expanded to include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.
    Type of Medium: Online Resource
    ISSN: 2380-4491
    URL: Article
    DOI: 10.4071/2011DPC-wa11
    Language: English
    Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
    Publication Date: 2011
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  • 5
    Online Resource
    Online Resource
    Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
    IMAPS - International Microelectronics Assembly and Packaging Society ; 2010
    In:  Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) Vol. 2010, No. DPC ( 2010-01-01), p. 002131-002152
    Details
    In: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), IMAPS - International Microelectronics Assembly and Packaging Society, Vol. 2010, No. DPC ( 2010-01-01), p. 002131-002152
    Abstract: Optomec's patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-dimensional semiconductor packaging. This presentation highlights results of printing high density, 3-D interconnects on stacked die modules which incorporate video, communication and memory chips. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices. The Aerosol Jet system is used to deposit silver nanoparticle ink connections along the staircase sidewall of staggered multi-chip die stacks. High aspect ratio interconnects with 30-micron line width and greater than 10-micron line height are demonstrated at a pitch of 61-microns. After printing, the silver inks are cured at ~200°C for ~30 minutes, which gives interconnect resistances below one-Ohm ( & lt; 5 micron Ohm*cm). The stacks can include up to 8 die, with a total stack height below 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. Based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies.
    Type of Medium: Online Resource
    ISSN: 2380-4491
    URL: Article
    DOI: 10.4071/2010DPC-tha15
    Language: English
    Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
    Publication Date: 2010
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    Online Resource
  • 6
    Online Resource
    Online Resource
    Aerosol Jet Printed, Low Voltage, Electrolyte Gated Carbon Nanotube Ring Oscillators with Sub-5 μs Stage Delays
    American Chemical Society (ACS) ; 2013
    In:  Nano Letters Vol. 13, No. 3 ( 2013-03-13), p. 954-960
    Details
    In: Nano Letters, American Chemical Society (ACS), Vol. 13, No. 3 ( 2013-03-13), p. 954-960
    Type of Medium: Online Resource
    ISSN: 1530-6984 , 1530-6992
    URL: Article
    DOI: 10.1021/nl3038773
    Language: English
    Publisher: American Chemical Society (ACS)
    Publication Date: 2013
    detail.hit.zdb_id: 2048866-X
    SSG: 11
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  • 7
    Online Resource
    Online Resource
    Otterly diverse - A high diversity of Dracunculus species (Spirurida: Dracunculoidea) in North American river otters (Lontra canadensis)
    Elsevier BV ; 2024
    In:  International Journal for Parasitology: Parasites and Wildlife Vol. 23 ( 2024-04), p. 100922-
    Details
    In: International Journal for Parasitology: Parasites and Wildlife, Elsevier BV, Vol. 23 ( 2024-04), p. 100922-
    Type of Medium: Online Resource
    ISSN: 2213-2244
    URL: Article
    DOI: 10.1016/j.ijppaw.2024.100922
    Language: English
    Publisher: Elsevier BV
    Publication Date: 2024
    detail.hit.zdb_id: 2715239-X
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  • 8
    Online Resource
    Online Resource
    Aerosol-Based Direct-Write of Biological Materials for Biomedical Applications
    Springer Science and Business Media LLC ; 2001
    In:  MRS Proceedings Vol. 698 ( 2001)
    Details
    In: MRS Proceedings, Springer Science and Business Media LLC, Vol. 698 ( 2001)
    Abstract: Applying life sciences and engineering principles to the study of cells and engineered tissue has resulted in various successes. These endeavors are poised towards development of functional neo-organs used as native tissue substitutes. Concurrent with this goal, research arenas are directed in the general areas of biocompatible polymer scaffolds, biomimmetic extracellular matrices, control of stem cell differentiation, biomolecule signaling, and directed material delivery. Optomec Inc. is developing an aerosol-based direct-write process for deposition of biological materials into three dimensional, micron-scale patterns. The process uses pneumatic atomization to produce aerosol droplets of proteinacious colloidal dispersions and whole cell suspensions. The droplets are entrained in an air stream and deposited with a proprietary deposition tool. The biological materials can be seeded into three dimensional polymer scaffolds and various substrate surfaces. Optomec's direct write process has applicability to the additive fabrication of engineered tissue. Other applications of the direct write tool include rapid prototyping of analytical biosensors, hybrid BioMEMS, and bio-chip microarray devices.
    Type of Medium: Online Resource
    ISSN: 0272-9172 , 1946-4274
    URL: Article
    DOI: 10.1557/PROC-698-Q5.2.1
    Language: English
    Publisher: Springer Science and Business Media LLC
    Publication Date: 2001
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  • 9
    Online Resource
    Online Resource
    Laser Guidance and Trapping of Mesoscale Particles in Hollow-Core Optical Fibers
    American Physical Society (APS) ; 1999
    In:  Physical Review Letters Vol. 82, No. 7 ( 1999-2-15), p. 1574-1577
    Details
    In: Physical Review Letters, American Physical Society (APS), Vol. 82, No. 7 ( 1999-2-15), p. 1574-1577
    Type of Medium: Online Resource
    ISSN: 0031-9007 , 1079-7114
    URL: Article
    DOI: 10.1103/PhysRevLett.82.1574
    RVK:
    UA 1000
    RVK:
    UA 6520
    Language: English
    Publisher: American Physical Society (APS)
    Publication Date: 1999
    detail.hit.zdb_id: 1472655-5
    detail.hit.zdb_id: 208853-8
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  • 10
    Online Resource
    Online Resource
    Two-step cell patterning on planar and complex curved surfaces by precision spraying of polymers
    Wiley ; 2006
    In:  Biotechnology and Bioengineering Vol. 93, No. 5 ( 2006-04-05), p. 919-927
    Details
    In: Biotechnology and Bioengineering, Wiley, Vol. 93, No. 5 ( 2006-04-05), p. 919-927
    Type of Medium: Online Resource
    ISSN: 0006-3592 , 1097-0290
    URL: Issue
    URL: Journal
    URL: Article
    DOI: 10.1002/bit.v93:5
    DOI: 10.1002/(ISSN)1097-0290
    DOI: 10.1002/bit.20787
    Language: English
    Publisher: Wiley
    Publication Date: 2006
    detail.hit.zdb_id: 1480809-2
    detail.hit.zdb_id: 280318-5
    SSG: 12
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