In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 34, No. 9R ( 1995-09-01), p. 4880-
Abstract:
A biaxially stretched film of BEK, a new engineering plastic with high heat resistance ( T g : 181° C, T m : 364° C) and chemical resistance, was developed as a base film for flexible printed circuit boards. Its heat shrinkage percentage at 260° C and the coefficient of thermal expansion below T g were decreased to below 0.1%, and 3.3×10 -5 /° C, respectively. The process of determining stretching and heat setting conditions for film formation with a role stretcher and a tenter is reported.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.34.4880
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
1995
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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