In:
Solid State Phenomena, Trans Tech Publications, Ltd., Vol. 124-126 ( 2007-6), p. 25-28
Abstract:
For flip-chip process of RF system-on-packages(SOP), double bump bonding processes
were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The
height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder
join ts was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints.
The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.
Type of Medium:
Online Resource
ISSN:
1662-9779
DOI:
10.4028/www.scientific.net/SSP.124-126
DOI:
10.4028/www.scientific.net/SSP.124-126.25
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2007
detail.hit.zdb_id:
2051138-3
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