In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 39, No. 12S ( 2000-12-01), p. 7070-
Abstract:
Diamond molds were fabricated by two types of fabrication processes, both of which use a conductive intermediate layer between the diamond surface and polymethylmethacrylate (PMMA) resist to prevent surface charge-up. Using a PtPd intermediate layer, electron beam lithography and ion beam etching, a denting line pattern of 600 nm width and 70 nm depth was fabricated. Using a carbon intermediate layer, electron beam lithography, PtPd lift-off and oxygen ion beam etching, a convex line pattern of 600 nm width and 110 nm height was fabricated. These diamond molds were pressed into PMMA on a silicon substrate that was heated to a temperature of 150°C and kept at a pressure of 23.5 MPa until the temperature dropped below 90°C, and then the diamond mold was released from the PMMA. The convex line pattern of 600 nm width and 150 nm height was imprinted using a denting diamond mold. The denting pattern of 1100 nm width and 180 nm height was imprinted using a convex diamond mold. PMMA patterns were transferred well over the imprinted area by the diamond molds.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.39.7070
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2000
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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