In:
International Journal of Materials Research, Walter de Gruyter GmbH, Vol. 97, No. 4 ( 2022-01-07), p. 475-479
Abstract:
The processing temperature of chemical and physical vapor deposition could be successfully lowered by applying inductively coupled plasma without deteriorating the film quality. Despite the low process temperature, the deposition rate was higher than that observed in conventional deposition processes, and the impurity content could be kept low. Some examples of inductively coupled plasma applicationse. g. TiB 2 , TiN, TiO 2 , and SnO 2 films are shown.
Type of Medium:
Online Resource
ISSN:
2195-8556
,
1862-5282
DOI:
10.1515/ijmr-2006-0077
Language:
English
Publisher:
Walter de Gruyter GmbH
Publication Date:
2022
detail.hit.zdb_id:
2232675-3
detail.hit.zdb_id:
2128058-7
detail.hit.zdb_id:
203021-4
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