In:
ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2014-01, No. 8 ( 2014-04-01), p. 513-513
Abstract:
Thin copper-nickel multi-layers with nano-thickness were prepared by pulse electro-plating. Transmission electron microscopy (TEM) revealed that the average thickness of the copper and nickel layers were about 14 and 16 nm. Annealing of the multi-layers at the temperature range of 300 and 600 o C resulted in producing interface grooving. Small angle neutron scattering (SANS) well proved non-destructively that the interface grooving completely occurred above 500 o C. The interface energy of the copper-nickel layer with nano-thickness will be determined by atomic force microscopy.
Type of Medium:
Online Resource
ISSN:
2151-2043
DOI:
10.1149/MA2014-01/8/513
Language:
Unknown
Publisher:
The Electrochemical Society
Publication Date:
2014
detail.hit.zdb_id:
2438749-6
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