In:
Angewandte Chemie, Wiley, Vol. 129, No. 24 ( 2017-06-06), p. 6853-6856
Abstract:
A new resist material for electron beam lithography has been created that is based on a supramolecular assembly. Initial studies revealed that with this supramolecular approach, high‐resolution structures can be written that show unprecedented selectivity when exposed to etching conditions involving plasmas.
Type of Medium:
Online Resource
ISSN:
0044-8249
,
1521-3757
DOI:
10.1002/ange.v129.24
DOI:
10.1002/ange.201700224
Language:
English
Publisher:
Wiley
Publication Date:
2017
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505872-7
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1479266-7
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