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  • 1
    Online Resource
    Online Resource
    Effect of Sodium Hydroxide (NaOH) Concentration on Compressive Strength of Alkali-Activated Slag (AAS) Mortars
    Trans Tech Publications, Ltd. ; 2015
    In:  Applied Mechanics and Materials Vol. 754-755 ( 2015-4), p. 300-304
    Details
    In: Applied Mechanics and Materials, Trans Tech Publications, Ltd., Vol. 754-755 ( 2015-4), p. 300-304
    Abstract: Energy saving in building technology is among the most critical problems in the world. Thus it is a need to develop sustainable alternatives to conventional concrete utilizing more environmental friendly materials. One of the possibilities to work out is the massive usage of industrial wastes like ground granulated blast furnace slag (GGBS) to turn them to useful environmental friendly and technologically advantageous cementitious materials. In this study, ground granulated blast furnace slag (GGBS) is used to produce of alkali activated slag (AAS) mortar with the effect of alkaline activator concentration. Alkali activated slag (AAS) mortar is accelerated using alkaline solution of sodium silicate mixed with sodium hydroxide. The fixed ratio of sodium silicate to sodium hydroxide is 1.7 and the concentration of sodium hydroxide is varied from 6M to 12M. Concentration of 10M NaOH promotes the best properties of mortar by achieving the greatest compressive strength. Substitution of mineral admixture also influences strength performance of AAS mortars. The mortar with 20% calcium carbonate demonstrates the maximum compressive strength. The used of alkaline activation system is the best method to prepare industrial byproduct concrete. Moreover, alkali activated product itself gains superior properties which lead to the system become the most interesting method to produce sustainable concrete.
    Type of Medium: Online Resource
    ISSN: 1662-7482
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/AMM.754-755
    DOI: 10.4028/www.scientific.net/AMM.754-755.300
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2015
    detail.hit.zdb_id: 2251882-4
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  • 2
    Online Resource
    Online Resource
    Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing
    IOP Publishing ; 2019
    In:  IOP Conference Series: Materials Science and Engineering Vol. 701 ( 2019-12-19), p. 012001-
    Details
    In: IOP Conference Series: Materials Science and Engineering, IOP Publishing, Vol. 701 ( 2019-12-19), p. 012001-
    Type of Medium: Online Resource
    ISSN: 1757-899X
    URL: Article
    DOI: 10.1088/1757-899X/701/1/012001
    Language: Unknown
    Publisher: IOP Publishing
    Publication Date: 2019
    detail.hit.zdb_id: 2506501-4
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  • 3
    Online Resource
    Online Resource
    Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating
    IOP Publishing ; 2020
    In:  IOP Conference Series: Materials Science and Engineering Vol. 957, No. 1 ( 2020-10-01), p. 012062-
    Details
    In: IOP Conference Series: Materials Science and Engineering, IOP Publishing, Vol. 957, No. 1 ( 2020-10-01), p. 012062-
    Abstract: It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) whiskers and consequently became a possible candidate as a lead-free alloys coating material in the microelectronics industry. In this study, the effect of 0.05 wt.% Ni addition on the formation and growth of Sn whisker in Sn-0.7Cu solder coatings have been investigated under continuous mechanically stress induced at room temperature. It is clearly found that Ni addition have significantly enhanced stress relaxation by reducing the growth rate of formation Sn whiskers in Sn-0.7Cu solder coatings. The morphology of (Cu,Ni)6Sn5 interfacial IMC was more refine and thinner with a fine scallop-shaped interfacial intermetallic layer purposely to lower the compressive stress of Sn coating and extend the nucleation period, thus mitigating the formation and growth of Sn whiskers.
    Type of Medium: Online Resource
    ISSN: 1757-8981 , 1757-899X
    URL: Article
    DOI: 10.1088/1757-899X/957/1/012062
    Language: Unknown
    Publisher: IOP Publishing
    Publication Date: 2020
    detail.hit.zdb_id: 2506501-4
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  • 4
    Online Resource
    Online Resource
    A Study of Liberation and Separation Process of Metals from Printed Circuit Boards (PCBs) Scraps
    Trans Tech Publications, Ltd. ; 2013
    In:  Key Engineering Materials Vol. 594-595 ( 2013-12), p. 123-127
    Details
    In: Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 594-595 ( 2013-12), p. 123-127
    Abstract: Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards (PCBs), a pre-treatment process allowing their liberation and separation is first needed in order to facilitate proficient extraction. In this work, a fundamental study has been carried out to recover metallic concentrates from PCBs scraps. The most important step is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic Separator. Then, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. Results show that the unliberated particles still remain in the comminution fines PCBs. The use of Rare-earth roll magnetic separation was clarified that the Fe, Ni and Zn element tend to be condensed in magnetic particles. Meanwhile Cu element tends to be release in non-magnetic particles. Mozley Laboratory Table Separation was capable to obtain fractions with relatively high concentrations of metallic elements. This study is expected to provide useful data for the efficient physical separation of metallic components from printed circuit boards scraps.
    Type of Medium: Online Resource
    ISSN: 1662-9795
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/KEM.594-595
    DOI: 10.4028/www.scientific.net/KEM.594-595.123
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2013
    detail.hit.zdb_id: 2073306-9
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  • 5
    Online Resource
    Online Resource
    Control of the Crystal Morphological Characteristic and Size of Nano-PCC via Turbo-Mixing Reactive Precipitation
    Trans Tech Publications, Ltd. ; 2015
    In:  Applied Mechanics and Materials Vol. 754-755 ( 2015-4), p. 770-774
    Details
    In: Applied Mechanics and Materials, Trans Tech Publications, Ltd., Vol. 754-755 ( 2015-4), p. 770-774
    Abstract: An innovative and novel technology method of processing called Turbo-Mixing Reactive Precipitation (TMRP) design proposed as an alternative to this current processing or conventional productions of fine precipitated calcium carbonate (nanoPCC) in turbo-mixing conditions. In this paper, the effect of the stirring rate onto morphology, particle sizes and reaction time of the precipitated CaCO 3 particles was discussed. CaCO 3 nanoparticles with an average particle size of approximately 15.75 nm were successfully obtained by stirring rotation speed at 900 rpm. The structural analysis was conducted using a Scanning Electron Microscope (SEM) and a Field Emission Scanning Electron Microscope (FESEM). The results showed that the increasing of the multiple’s impeller stirring rotation speed is in favor of the formation of the spherical vaterite.
    Type of Medium: Online Resource
    ISSN: 1662-7482
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/AMM.754-755
    DOI: 10.4028/www.scientific.net/AMM.754-755.770
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2015
    detail.hit.zdb_id: 2251882-4
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  • 6
    Online Resource
    Online Resource
    Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
    MDPI AG ; 2023
    In:  Materials Vol. 16, No. 5 ( 2023-02-24), p. 1852-
    Details
    In: Materials, MDPI AG, Vol. 16, No. 5 ( 2023-02-24), p. 1852-
    Abstract: This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature.
    Type of Medium: Online Resource
    ISSN: 1996-1944
    URL: Article
    DOI: 10.3390/ma16051852
    Language: English
    Publisher: MDPI AG
    Publication Date: 2023
    detail.hit.zdb_id: 2487261-1
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  • 7
    Online Resource
    Online Resource
    Characteristics of Mortars with Various Composition of Ground Granulated Blast Furnace Slag
    Trans Tech Publications, Ltd. ; 2015
    In:  Applied Mechanics and Materials Vol. 754-755 ( 2015-4), p. 305-309
    Details
    In: Applied Mechanics and Materials, Trans Tech Publications, Ltd., Vol. 754-755 ( 2015-4), p. 305-309
    Abstract: The characteristics of mortars made from ordinary Portland cement with various composition of ground granulated blast furnace slag (GGBS) were investigated in this research. Ground granulated blast furnace slag (GGBS) was chose as an alternative binder to partially replace high energy consuming Portland cement in concrete according to the composition of the slag itself. GGBS were blended with Portland cement from 20 to 80 weight percent. The samples were mechanically tested for water absorption and compressive strength after 7, 14 and 28 days. From research, the most suitable proportion is 60% OPC + 40% GGBS which gain the highest compressive strength and the lowest water absorption among OPC blended mortars. These mortars used water to hydrate and solidify with ratio water to binders 0.7 equally.
    Type of Medium: Online Resource
    ISSN: 1662-7482
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/AMM.754-755
    DOI: 10.4028/www.scientific.net/AMM.754-755.305
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2015
    detail.hit.zdb_id: 2251882-4
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  • 8
    Online Resource
    Online Resource
    Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
    MDPI AG ; 2021
    In:  Materials Vol. 14, No. 4 ( 2021-02-05), p. 738-
    Details
    In: Materials, MDPI AG, Vol. 14, No. 4 ( 2021-02-05), p. 738-
    Abstract: The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
    Type of Medium: Online Resource
    ISSN: 1996-1944
    URL: Article
    DOI: 10.3390/ma14040738
    Language: English
    Publisher: MDPI AG
    Publication Date: 2021
    detail.hit.zdb_id: 2487261-1
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  • 9
    Online Resource
    Online Resource
    Tin (Sn) whisker growth from electroplated Sn finished
    IOP Publishing ; 2019
    In:  IOP Conference Series: Materials Science and Engineering Vol. 701, No. 1 ( 2019-12-01), p. 012005-
    Details
    In: IOP Conference Series: Materials Science and Engineering, IOP Publishing, Vol. 701, No. 1 ( 2019-12-01), p. 012005-
    Abstract: Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, since prohibiting the use of lead (Pb) in electronics, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic device. This paper investigates the effect of electroplating current density (10, 30 and 50 mA/cm 2 ) on whisker growth at room temperature. A simple micro- indentation test was used to accelerate continuously the growth of Sn whisker at room temperature storage for 24 h. Morphology analysis of Sn whisker growth was done using scanning electron microscope (SEM) and image-J Software. Axial length of the Sn whisker was calculated by using JEDEC Standards (JESD22-A121A).
    Type of Medium: Online Resource
    ISSN: 1757-8981 , 1757-899X
    URL: Article
    DOI: 10.1088/1757-899X/701/1/012005
    Language: Unknown
    Publisher: IOP Publishing
    Publication Date: 2019
    detail.hit.zdb_id: 2506501-4
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  • 10
    Online Resource
    Online Resource
    Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin Alloys Coatings: A Short Review
    Trans Tech Publications, Ltd. ; 2018
    In:  Solid State Phenomena Vol. 280 ( 2018-8), p. 151-156
    Details
    In: Solid State Phenomena, Trans Tech Publications, Ltd., Vol. 280 ( 2018-8), p. 151-156
    Abstract: Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came into effect in Europe and Asia on July 1, 2006, requiring the removal of any lead (Pb) content from the electronics industry, the issue of tin (Sn) whisker growth from pure Sn and SnPb-free alloys has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whiskers grow spontaneously from an electrodeposited tin coating on a copper substrate at room temperature, which can lead to well-documented system failures in electronics industries. The Sn whisker phenomenon unavoidably gives rise to troubles. This paper briefly reviews to better understand the fundamental properties of Sn whisker growth and at the same time discover the effective mitigation practices for whisker growth in green electronic devices. It is generally accepted that compressive stress generated from the growth of Cu 6 Sn 5 intermetallic compound (IMC) is the primary driving force for Sn whisker growth during room temperature storage. It is, therefore, important to determine that the relationship between IMC growth and Sn whisker growth. Reduction of stress in the IMC layer can therefore reduce the driving force for whisker formation and be used as a means for whisker mitigation. To date, there are no successful methods that can suppress the growth of Sn whisker as efficient as Pb addition. It is hoped that the Sn whisker growth mechanisms are understood better in the future, with better measuring and monitoring methodologies and systems being developed, the real solutions may be eventually developed to eliminate or mitigate the Sn whisker problems of green reliability lead-free electronic assemblies.
    Type of Medium: Online Resource
    ISSN: 1662-9779
    URL: Issue
    URL: Article
    DOI: 10.4028/www.scientific.net/SSP.280
    DOI: 10.4028/www.scientific.net/SSP.280.151
    Language: Unknown
    Publisher: Trans Tech Publications, Ltd.
    Publication Date: 2018
    detail.hit.zdb_id: 2051138-3
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