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  • 1
    Online Resource
    Online Resource
    Elsevier BV ; 1991
    In:  Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms Vol. 55, No. 1-4 ( 1991-4), p. 77-81
    In: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Elsevier BV, Vol. 55, No. 1-4 ( 1991-4), p. 77-81
    Type of Medium: Online Resource
    ISSN: 0168-583X
    Language: English
    Publisher: Elsevier BV
    Publication Date: 1991
    detail.hit.zdb_id: 1466524-4
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  • 2
    Online Resource
    Online Resource
    American Vacuum Society ; 1998
    In:  Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena Vol. 16, No. 1 ( 1998-01-01), p. 286-291
    In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 16, No. 1 ( 1998-01-01), p. 286-291
    Abstract: Secondary ion mass spectrometry and spreading resistance profiling techniques have been used to measure dopant profiles and determine electrical activation in ion-implanted samples with effective ion energies as low as 112 eV (i.e., for 0.5 keV BF2). The analytical protocols will be discussed and used to compare the results for samples implanted with ion energies ranging from 0.5 keV (B and BF2) to 8.9 keV (BF2), with and without Ge preamorphization (with and without solid phase epitaxy anneals at 550 °C for 30 min), and finally annealed at 750–1050 °C for 10 s. Limitations of both analytical techniques for ultrashallow junction characterization and areas where improvements are required are discussed.
    Type of Medium: Online Resource
    ISSN: 1071-1023 , 1520-8567
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 1998
    detail.hit.zdb_id: 3117331-7
    detail.hit.zdb_id: 3117333-0
    detail.hit.zdb_id: 1475429-0
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  • 3
    Online Resource
    Online Resource
    American Vacuum Society ; 1996
    In:  Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena Vol. 14, No. 1 ( 1996-01-01), p. 397-403
    In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 14, No. 1 ( 1996-01-01), p. 397-403
    Abstract: The evaluation of the doping process requires the ability to measure accurate depth profiles. In this study, the accuracy of electrical measurement techniques is evaluated for the measurement of ultra-shallow dopant profiles. The methods investigated are spreading resistance profiling, electrochemical capacitance–voltage profiling, differential Hall effect profiling, tapered-groove profilometry, and a new method called microwave surface impedance profiling. The focus of this article is the comparative study of the different methods and an evaluation of the accuracy of the profiles. The study points out details of the measurements and analysis which are important in obtaining consistent and accurate measurements of ultra-shallow junctions.
    Type of Medium: Online Resource
    ISSN: 1071-1023 , 1520-8567
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 1996
    detail.hit.zdb_id: 3117331-7
    detail.hit.zdb_id: 3117333-0
    detail.hit.zdb_id: 1475429-0
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  • 4
    Online Resource
    Online Resource
    Springer Science and Business Media LLC ; 2006
    In:  MRS Proceedings Vol. 912 ( 2006)
    In: MRS Proceedings, Springer Science and Business Media LLC, Vol. 912 ( 2006)
    Abstract: Implementation of millisecond annealing requires the identification of the operating conditions for that technique which minimize the residual defects. In addition, possible combinations of low temperature annealing with millisecond annealing could result in minimal residual defects. The samples studied here were implanted with Ge+ pre-amorphization and boron dopant ions and were activated with a scanning laser annealing technique with maximum temperature dwell times of about one millisecond. The laser anneal conditions were varied, along with combinations of spike anneals. The annealed samples were analyzed by plan-view transmission electron microscopy (TEM) to measure the residual defect density and size. The effects of spike temperature, laser annealing temperature, and scan rate will be discussed.
    Type of Medium: Online Resource
    ISSN: 0272-9172 , 1946-4274
    Language: English
    Publisher: Springer Science and Business Media LLC
    Publication Date: 2006
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  • 5
    Online Resource
    Online Resource
    Springer Science and Business Media LLC ; 2006
    In:  MRS Proceedings Vol. 912 ( 2006)
    In: MRS Proceedings, Springer Science and Business Media LLC, Vol. 912 ( 2006)
    Abstract: As the fabrication for the CMOS technology trends to decreasing the size of transistors for the benefit of increased performance and device density, the implant and annealing process technologies are being forced to meet increasingly challenging demands for ultra-shallow junctions. As the current annealing preferences shift from rapid thermal annealing toward sub-second RTP technologies such as flash and laser annealing, the dynamics of micro-structural evolution on the order of milliseconds and microseconds become of increasing importance. To investigate the kinetics in this ultra-fast annealing regime, this study investigated the effect of varying the temperature and time of a scanning laser anneal in the millisecond and microsecond timeframe. Amorphous layers were created in silicon substrates using a 30 keV silicon implant at a dose of 1x10 15 ions/cm 3 . These wafers were then processed using a scanning continuous wave near infra-red laser at varying temperatures and scan rates in order to vary the dwell time of each condition. A combination of sheet resistance, optical interferometry, and secondary ion mass spectrometry characterization techniques were used in order to investigate the activation and diffusion of these laser annealed samples. The regrowth temperature across all samples showed a positive correlation to the sheet resistance; trending toward lower values as temperatures increased. Dwell time, however, showed an inverse effect at lower temperatures. The microsecond anneal at 1200 °C showed a lower Rs than the millisecond anneal, while at higher temperatures the trend reversed. This trending shows an obvious competition between activation and diffusion mechanisms and their dependence on regrowth temperature.
    Type of Medium: Online Resource
    ISSN: 0272-9172 , 1946-4274
    Language: English
    Publisher: Springer Science and Business Media LLC
    Publication Date: 2006
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  • 6
    Online Resource
    Online Resource
    Elsevier BV ; 1987
    In:  Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms Vol. 21, No. 1-4 ( 1987-1), p. 360-365
    In: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Elsevier BV, Vol. 21, No. 1-4 ( 1987-1), p. 360-365
    Type of Medium: Online Resource
    ISSN: 0168-583X
    Language: English
    Publisher: Elsevier BV
    Publication Date: 1987
    detail.hit.zdb_id: 1466524-4
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  • 7
    Online Resource
    Online Resource
    American Association of Physics Teachers (AAPT) ; 1984
    In:  The Physics Teacher Vol. 22, No. 3 ( 1984-03-01), p. 142-149
    In: The Physics Teacher, American Association of Physics Teachers (AAPT), Vol. 22, No. 3 ( 1984-03-01), p. 142-149
    Abstract: A review is given of two experiments in progress at Stanford University. These studies are attempting to detect quarks and magnetic monopoles using the superconducting properties of niobium. (AIP)
    Type of Medium: Online Resource
    ISSN: 0031-921X , 1943-4928
    Language: English
    Publisher: American Association of Physics Teachers (AAPT)
    Publication Date: 1984
    detail.hit.zdb_id: 2066897-1
    detail.hit.zdb_id: 391692-3
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  • 8
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2006-02, No. 20 ( 2006-06-30), p. 1007-1007
    Abstract: Abstract not Available.
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2006
    detail.hit.zdb_id: 2438749-6
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  • 9
    Online Resource
    Online Resource
    Springer Science and Business Media LLC ; 1987
    In:  MRS Proceedings Vol. 92 ( 1987)
    In: MRS Proceedings, Springer Science and Business Media LLC, Vol. 92 ( 1987)
    Abstract: Rapid thermal processing has previously been observed to affect the dielectric integrity of thin oxides.' In order to study this phenomenon in more detail, we have fabricated a set of wafers with 290 Å thick gate oxide and patterned pads of 2000 Å thick doped polysilicon. Some of the pads were patterned with a wet etch, while others were dry etched in a commercial reactive ion etcher (RIE), which is suspected to be a damaging process. To simulate a self-aligned MOS process, some of the patterned wafers were also ion implanted with 70 keV, 2E15 As + /cm 2 . Subsequently, all of the wafers were rapidly annealed in a Varian RTP-800 lamp annealer under a variety of conditions (lO00-1100 ° C, 10-30 sec), and the breakdown characteristics of the MOS capacitors were measured. A few control samples were annealed in a furnace. It was found that the rapid annealing cycle without ion implantation or dry etching caused no deterioration of the oxide quality. However, rapid annealing after either RIE or implantation does result in oxide breakdowns at lower voltages, with those capacitors having higher perimeter-toarea ratios affected to a greater degree. The effect of capacitor shape and annealing conditions on breakdown statistics and uniformity will be presented and discussed in light of possible ion bombardment damage during RIE and oxide charging during ion implantation. Several mechanisms explaining the breakdown properties will be discussed.
    Type of Medium: Online Resource
    ISSN: 0272-9172 , 1946-4274
    Language: English
    Publisher: Springer Science and Business Media LLC
    Publication Date: 1987
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  • 10
    In: MRS Proceedings, Springer Science and Business Media LLC, Vol. 470 ( 1997)
    Abstract: 2. 0 keV 11 B + , 2.2 keV 49 BF 2 + ion implanted and 1.0 kV Plasma Doped (PLAD) wafers of a dose of 1E15/cm 2 were annealed at various times and temperatures in a variety of ambiente: 600 to 50,000 ppm O 2 in N 2 ; 5% NH 3 in N 2 ; N 2 O; N 2 or Ar, in order to investigate the effects of the annealing ambient on the formation of ultra-shallow junctions. RGA data was collected during some (if the anneals to assist in identifying the complex surface chemistry responsible for boron out-diffusion. Subsequent to the anneals, ellipsometric, XPS, four-point probe sheet resistance and SJJVIS measurements were performed to further elucidate the effects of the different ambients on the r etained boron dose, the sheet resistance value, the RTP grown oxide layer and the junction depth. In the cases where oxygen was present, e.g. N 2 O and O 2 in N 2 , an oxidation enhanced diffusion of the boron was observed. This was most dramatic for the N 2 O anneals, which at 1050°C 10s diffused the boron an additional 283 to 427 Å, depending on the particular doping condition and species. For the case of BF 2 implants and PLAD, anneals in 5% NH 3 in N 2 reduced the junction depth by a nitridation reduced diffusion mechanism. RGA data indicated that the out-diffusion mechanisms for B and BF 2 implanted wafers are different, with the BF 2 exhibiting dopant loss mechanisms during the 950°C anneals, producing F containing compounds. B implants did not show doping loss mechanisms, ais observed by the RGA, until the 1050°C anneals and these signals did not contain F containing compounds. Equivalent effective energy boron implants of 8.9 keV BF 2 vs. 2.0 keV B, however, indicated that the overall effect of the F in the BF 2 implants is very beneficial in the creation of ultra-shallow junctions (compared to B implants): reducing the junction depth by 428 Å, and increasing the electrical activation (determined by SRP) by 11.7%, even though the retained dose (resulting from an increased out-diffusion of B), was decreased by 5.4%.
    Type of Medium: Online Resource
    ISSN: 0272-9172 , 1946-4274
    Language: English
    Publisher: Springer Science and Business Media LLC
    Publication Date: 1997
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