In:
ECS Transactions, The Electrochemical Society, Vol. 52, No. 1 ( 2013-03-08), p. 507-512
Abstract:
Using mixed alkali which is mixed by inorganic base and organic base and potassium carbonate can prepare non-spherical colloidal silica and the two types of colloidal silica are well used in chemical mechanical polishing of silicon substrate surface. A lot of chemical mechanical polishing tests about the non-spherical colloidal silica have proved that non spherical colloidal silica which the particle size is about 50 nm can be used in chemical mechanical polishing whose removal rate is faster than 130nm spherical colloidal silica around 10%.
Type of Medium:
Online Resource
ISSN:
1938-5862
,
1938-6737
DOI:
10.1149/05201.0507ecst
Language:
Unknown
Publisher:
The Electrochemical Society
Publication Date:
2013
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