In:
Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 419-420 ( 2009-10), p. 489-492
Abstract:
Two major analyses were conducted in this paper. In the first, experimental procedures are accomplished to measure the tensile mechanical properties of ultra thin gold wire (=1mil) before/after electric flame-off (EFO). Characteristics of free air ball (FAB), heat affected zone (HAZ) and as-drawn wire have been carefully investigated by nanoindentation, microhardness and self-design pull test fixture. Secondary, with the obtained experimental material data, a comprehensive finite element model using software ANSYS/LS-DYNA is successfully developed to simulate the wirebonding. Dynamic analysis is performed to evaluate the overall stress distributions on the underlay microstructure of Cu/low-k wafer. Special emphasizes are focused on the Copper via and the intermetal dielectric (IMD)/undoped silica glass (USG) dielectric microstructure.
Type of Medium:
Online Resource
ISSN:
1662-9795
DOI:
10.4028/www.scientific.net/KEM.419-420
DOI:
10.4028/www.scientific.net/KEM.419-420.489
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2009
detail.hit.zdb_id:
2073306-9
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