In:
Surface Review and Letters, World Scientific Pub Co Pte Ltd, Vol. 17, No. 02 ( 2010-04), p. 201-205
Abstract:
SiC -mixed Sn–58Bi composite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersed SiC nanoparticles were added to the plating solutions. DSC analysis indicated that the melting temperature of SiC -mixed Sn–58Bi solders was the same as that of the non-mixed Sn–58Bi . Shear strengths of Sn–58Bi+SiC solder bumps were 6% higher than that of non-mixed solder bumps. The thicknesses of intermetallic compound were almost the same for both Sn–58Bi and Sn–58Bi+SiC samples. The Sn–58Bi+SiC composite solder bumps had finer lamellar structures than non-mixed Sn–58Bi . From the fracture surface analysis, fracture occurred at solder bump matrix, not at joint interface. Therefore, the addition of the SiC nanoparticles in the Sn–58Bi solders decreased the grain sizes, which increased the shear strengths.
Type of Medium:
Online Resource
ISSN:
0218-625X
,
1793-6667
DOI:
10.1142/S0218625X10013795
Language:
English
Publisher:
World Scientific Pub Co Pte Ltd
Publication Date:
2010
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