In:
International Journal of Materials Research, Walter de Gruyter GmbH, Vol. 94, No. 4 ( 2022-02-03), p. 453-457
Abstract:
The growth kinetics of intermetallic compound layers formed between Sn–3Ag–8Bi – 5In solder and (Cu, electroless Ni – P/Cu) substrate were investigated at temperatures between 70 and 170 °C for 1 to 60 days. The layer growth of the intermetallic compounds in the Sn–Ag– Bi – In/Cu and Sn–Ag –Bi – In/electroless Ni –P systems satisfied the parabolic time law. As a whole, because the values of time exponent have approximately 0.5, the layer growth is mainly controlled by diffusion. The apparent activation energies for the growth of the Cu 6 Sn 5 and Ni 3 Sn 4 intermetallic compounds are 81.4 and 67.1 kJ/mol, respectively.
Type of Medium:
Online Resource
ISSN:
2195-8556
,
1862-5282
DOI:
10.1515/ijmr-2003-0078
Language:
English
Publisher:
Walter de Gruyter GmbH
Publication Date:
2022
detail.hit.zdb_id:
2232675-3
detail.hit.zdb_id:
2128058-7
detail.hit.zdb_id:
203021-4
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