In:
Defect and Diffusion Forum, Trans Tech Publications, Ltd., Vol. 263 ( 2007-3), p. 231-236
Abstract:
Interaction of lead-free solders with copper substrate represents an important
phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600
°C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75
% Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, microhardness
measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best
existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by
the CALPHAD (Calculation of Phase Diagrams) method and with other authors.
Type of Medium:
Online Resource
ISSN:
1662-9507
DOI:
10.4028/www.scientific.net/DDF.263
DOI:
10.4028/www.scientific.net/DDF.263.231
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2007
detail.hit.zdb_id:
2051135-8
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