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  • The Electrochemical Society  (10)
  • 1
    Online Resource
    Online Resource
    The Electrochemical Society ; 2009
    In:  ECS Meeting Abstracts Vol. MA2009-02, No. 7 ( 2009-07-10), p. 459-459
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2009-02, No. 7 ( 2009-07-10), p. 459-459
    Abstract: Abstract not Available.
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2009
    detail.hit.zdb_id: 2438749-6
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  • 2
    Online Resource
    Online Resource
    The Electrochemical Society ; 2007
    In:  ECS Meeting Abstracts Vol. MA2007-02, No. 2 ( 2007-09-28), p. 101-101
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2007-02, No. 2 ( 2007-09-28), p. 101-101
    Abstract: Abstract not Available.
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2007
    detail.hit.zdb_id: 2438749-6
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  • 3
    Online Resource
    Online Resource
    The Electrochemical Society ; 2016
    In:  ECS Transactions Vol. 75, No. 16 ( 2016-08-16), p. 277-279
    In: ECS Transactions, The Electrochemical Society, Vol. 75, No. 16 ( 2016-08-16), p. 277-279
    Abstract: Development of portable and flexible bending motion sensor has been recently flourished for a variety of devices involving integration with wearable electronics, human artificial skin, and biomimetic robots. Self-powered system might be significant for portable and environmentally compatible and persistent use in various applications. In this regard, adopting piezoelectric bending element is desirable for active sensing system as well as the superiority for ultra-flexible properties for wearable manufacturing. Here, a self-powered piezoelectric bending motion sensor has been developed for simultaneous detection of bending curvature and speed during mechanical bending throughout analysis of ratiocinative algorithm.
    Type of Medium: Online Resource
    ISSN: 1938-5862 , 1938-6737
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2016
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  • 4
    Online Resource
    Online Resource
    The Electrochemical Society ; 2001
    In:  Journal of The Electrochemical Society Vol. 148, No. 4 ( 2001), p. F56-
    In: Journal of The Electrochemical Society, The Electrochemical Society, Vol. 148, No. 4 ( 2001), p. F56-
    Type of Medium: Online Resource
    ISSN: 0013-4651
    RVK:
    Language: English
    Publisher: The Electrochemical Society
    Publication Date: 2001
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  • 5
    Online Resource
    Online Resource
    The Electrochemical Society ; 2005
    In:  Journal of The Electrochemical Society Vol. 152, No. 6 ( 2005), p. C348-
    In: Journal of The Electrochemical Society, The Electrochemical Society, Vol. 152, No. 6 ( 2005), p. C348-
    Type of Medium: Online Resource
    ISSN: 0013-4651
    RVK:
    Language: English
    Publisher: The Electrochemical Society
    Publication Date: 2005
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  • 6
    Online Resource
    Online Resource
    The Electrochemical Society ; 2005
    In:  Electrochemical and Solid-State Letters Vol. 8, No. 1 ( 2005), p. C1-
    In: Electrochemical and Solid-State Letters, The Electrochemical Society, Vol. 8, No. 1 ( 2005), p. C1-
    Type of Medium: Online Resource
    ISSN: 1099-0062
    Language: English
    Publisher: The Electrochemical Society
    Publication Date: 2005
    detail.hit.zdb_id: 1483551-4
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  • 7
    Online Resource
    Online Resource
    The Electrochemical Society ; 2018
    In:  ECS Meeting Abstracts Vol. MA2018-01, No. 46 ( 2018-04-13), p. 2652-2652
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2018-01, No. 46 ( 2018-04-13), p. 2652-2652
    Abstract: This study is to analyze the etch characteristic of line-patterned Cu flims under various etch conditions using non-halogen gases. The etching of Cu films has great difficulty due to very low volitility of Cu compounds formed by the reaction with conventional etch gases. Because of this fact, Cu patterining has been achieved by the damascene process containing thin film deposition and chemical mechanical processing. Although many researches were carried out since 1990s, no remarkable progress has been made. As the dimension of Cu pattern has been shrinked, the etching process of Cu films has become the main issue because the damascene process reveals fatal disadvantages. In this study, inductively coupled plasma reactive ion etching (ICPRIE) of Cu film was performed using non-greenhouse gases. Gas mixtures containing Cl 2 /Ar, HCl/Ar, HBr/Ar, O 2 /Ar, and H 2 /Ar were used to etch Cu thin films. In addition, the influences of the gas concentration, ICP power, gas pressure and dc- bias to substrate on each characteristic were investigated. The etch profiles and etch mechanism of Cu films were examined by field emission scanning electron microscopy, optical emission spectroscopy, and X-ray photoelectron spectroscopy, respectively. Acknowldgments This research was supported by the MOTIE(Ministry of Trade, Industry & Energy (10080450) and KSRC(Korea Semiconductor Research Consortium) support program for the development of the future semiconductor device.
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2018
    detail.hit.zdb_id: 2438749-6
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  • 8
    Online Resource
    Online Resource
    The Electrochemical Society ; 2016
    In:  ECS Meeting Abstracts Vol. MA2016-02, No. 50 ( 2016-09-01), p. 3824-3824
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2016-02, No. 50 ( 2016-09-01), p. 3824-3824
    Abstract: Development of portable and flexible bending motion sensors has been recently flourished for a variety of devices involving integration with wearable electronics, human artificial skin, and biomimetic robots. Most studies on bending motion sensors exploit transduction mechanism including resistivity, capacitance changes and optical phenomena, which essentially require external power supplies for operation of sensor system. However, self-powered system might be significant for portable and environmentally compatible and persistent system for potential uses in robotics or portable mobile electronics. In this regard, adopting piezoelectric bending elements is desirable for active sensing system as well as the superiority for ultra-flexible properties for wearable manufacturing. Multi-functional capabilities of motion sensing will enable high accurate detection of any external stimuli of bending motions. Most researches on piezoelectric bending motion sensors, however, have demonstrated a sensing algorithm based on the change of piezoelectric potential as a function of solely bending curvature. In fact, the piezoelectric signals are comprehensive results affected by various factors such as bending curvature and speed. More precisely, the output signal values are differentiated as a function of bending curvature, otherwise also distinguished by different bending speed at the same time. In this point of view, the piezoelectric output signals at the same bending curvature conditions with different bending speed will apparently have different signal values. Therefore, the dependence on output signals in response of bending motion across the piezo elements should be separately investigated in order to enhance the accuracy of sensing. For analysis of bending curvature and speed for detection of bending motions across the piezo elements, a systematic algorithm tool is required to be organized. Herein, a piezoelectric bending motion sensor has been developed for simultaneous recognition of bending curvature and speed through systematic analysis based on experimentally ratiocinative algorithm tool. Logically, the strategy for detection bending motion is to separate the influence of the bending curvature and speed while figure out the relationship between dependent variables characterizing a given piezoelectric signals with the independent variables. The dependent variables to be measured are a height, an area, and a width of voltage signals, whereas the independent variables to be estimated are bending curvature and speed. On the basis of the hypothesis, an experimentally ratiocinative algorithm was established for simultaneous recognition of bending curvature and speed across the piezoelectric bending motion sensors. Through simple three steps: measurement of output signals; construction of an algorithm; estimation of independent variables, sensing of the bending curvature and speed is simultaneously available with high accuracy. In addition, elastic piezoelectric composite material; ZnO nanorods (NR) - polydimethylsiloxane (PDMS) sandwiched structure and the mechanically stable and robust electrodes; Ag nanowire (NW) -single-wall carbon nanotube (SWCNT) hybrids are both remarkable to apply in flexible bending motions in piezoelectric sensory system. The hydrothermally grown ZnO NRs with bi-axial configuration were facile for bending motion sensing. The bi-axially grown ZnO NRs form uniform monolayer by simple rubbing process because of strong Van der Waals forces. Moreover, adoption of elastic electrodes of Ag NW-SWCNT guarantees flexibility without any structural cracks with consistent maintenance of electrical conductivity. From the configuration of piezoelectric structures, highly flexible piezoelectric bending motion sensing was actualized for any external stimuli. This reciprocal piezoelectric bending motion sensor and algorithm system can be a practical sensing methodology toward realization of artificial and wearable motion sensors. Figure 1
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2016
    detail.hit.zdb_id: 2438749-6
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  • 9
    Online Resource
    Online Resource
    The Electrochemical Society ; 2006
    In:  Journal of The Electrochemical Society Vol. 153, No. 7 ( 2006), p. G617-
    In: Journal of The Electrochemical Society, The Electrochemical Society, Vol. 153, No. 7 ( 2006), p. G617-
    Type of Medium: Online Resource
    ISSN: 0013-4651
    RVK:
    Language: English
    Publisher: The Electrochemical Society
    Publication Date: 2006
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  • 10
    Online Resource
    Online Resource
    The Electrochemical Society ; 2018
    In:  ECS Meeting Abstracts Vol. MA2018-01, No. 45 ( 2018-04-13), p. 2635-2635
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2018-01, No. 45 ( 2018-04-13), p. 2635-2635
    Abstract: As the critical dimension of the semiconductor memory device keeps shrinking, new etching method is required to etch nanometer-scale patterned thin film. Accordingly, we propose novel etching method called aerosol jet etching. This etching technique is to use an aerosol jet containing tiny liquid droplets which are made of an etchant. Liquid droplets are generated and accelerated onto the thin film by nozzle expansion into a vacuum chamber where the substrates are located. This method is intended to perform vertical anisotropic etching without redeposition by combining the chemical mechanism of wet etching and physical bombardment of particles in dry etching. Formation of nanometer-scale patterns by nanoetching process of thin films should be developed for the future semiconductor memory devices. Therefore, this new etching technique can be a prospective etching method. Also, this technique can be applied to nano-device, MEMS and various thin-film sensors. In this study, we have investigated the etch characteristics of nanometer-scale patterned thin films using aerosol jets which contain the tiny droplets of proper liquid etchants. We designed and optimized etching equiment for aerosol jet etching, and proceeded the characterization and development of nanometer-scale patterns by using it. As the major experimental parameters, there are the nozzle geometry (nozzle shape and nozzle diameter), nozzle to substrate distance, chamber pressure, and substrate temperature. The etch rates were obtained by the surface profilometer and field emission scanning electron microscopy (FESEM) and etch profiles were observed by FESEM. In addition, X-ray photoelectron spectroscopy were used for the investigation on the etched surfaces for the etch mechanism. Acknowldgments This work was supported by NRF-2017R1D1A1B03033143
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2018
    detail.hit.zdb_id: 2438749-6
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