In:
Journal of Composite Materials, SAGE Publications, Vol. 53, No. 10 ( 2019-05), p. 1411-1422
Abstract:
The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn 2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu 3.2 Zn 0.7 Al 4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu 3.2 Zn 0.7 Al 4.2 and an unstable phase of Al(Cu,Zn) 2 . The average shear strength of combined joints of MMC/Cu is 16.5 MPa.
Type of Medium:
Online Resource
ISSN:
0021-9983
,
1530-793X
DOI:
10.1177/0021998319835304
Language:
English
Publisher:
SAGE Publications
Publication Date:
2019
detail.hit.zdb_id:
160490-9
detail.hit.zdb_id:
2081924-9
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