In:
Journal of Japan Institute of Electronics Packaging, Japan Institute of Electronics Packaging, Vol. 2, No. 2 ( 1999), p. 121-126
Type of Medium:
Online Resource
ISSN:
1343-9677
,
1884-121X
Uniform Title:
AuとIn‐Sn系はんだの界面における金属間化合物成長過程
Language:
Japanese
Publisher:
Japan Institute of Electronics Packaging
Publication Date:
1999
detail.hit.zdb_id:
2265174-3
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