In:
Applied Physics Letters, AIP Publishing, Vol. 120, No. 6 ( 2022-02-07)
Abstract:
This study changed the material thickness (0.5–2.7 μm) to control the orientation of microstructure for tailoring the thermopower factor of CuCr0.85Mg0.15O2 films. As a result, the (110)-preferred orientation and copper vacancies were dominant in the thicker film, which increased conductivity σ. The Seebeck coefficient S remained unchanged within the wide film thickness range despite the remarkable increment in σ. Therefore, the thermopower factor (PF = S2σ) of the CuCr0.85Mg0.15O2 films drastically increased with the increase in the film's thickness, reaching 720 μW/mK2 at 500 °C in a 2.0 μm-thick CuCr0.85Mg0.15O2 film. This value is better than that observed in the bulk materials. A detailed discussion of physical mechanisms is presented in this manuscript.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2022
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0
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