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  • American Institute of Physics (AIP)  (2)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 2542-2548 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We propose a field-effect tunnel transistor based on the metal–insulator transition. The principle of the switching is the metal–insulator transition, which occurs at the sheet resistance RQ (∼h/e2=25.8 kΩ). The modulation of the sheet resistance around RQ by the control gates can be magnified by the phase transition. As a result, high transconductance and high current drivability more than 10 times greater than the ultimate silicon metal-oxide-semiconductor transistors are obtained. The device is a thin-film silicon-on-insulator structure with dual gates, one on each side of the channel. A very thin granular metal film is deposited on the Si layer. Each metal island forms a Schottky contact with the Si layer, which is completely depleted. The electrons in the metal tunnel between the islands through the Si. The metal film can have a higher Coulomb gap and current drivability than is obtained with a single tunnel junction. A temperature of less than 1/20 of the Coulomb gap energy is required to reduce the leakage current by three orders of magnitude with the Coulomb blockade mechanism. Using the Wentzel–Kramers–Brillouin approximation, we calculated the tunneling probability between the islands and evaluated the sheet resistance of the metal film. Changing the gate voltage can modulate the sheet resistance in spite of the very narrow spacing between the islands. In the high resistance regime, the Coulomb blockade can operate and the resistance is three orders of magnitude higher than the bare tunnel resistance. In the "on'' state, on the other hand, a very low sheet resistance of less than 1 kΩ per square is obtained. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The adsorption of tungsten hexafluoride (WF6) and monosilane (SiH4) in selective chemical-vapor deposition (CVD) of tungsten (W) is investigated in situ using Fourier-transform infrared reflection and transmission absorption spectroscopy (FTIR RAS and TMS). The selectivity for W growth is found to originate from the dissociation of SiH4 on a W surface. That is, SiH4 dissociates on a W surface to form Si-containing adsorbed species when the W surface is exposed to SiH4 at temperatures higher than 110 °C, whereas SiH4 does not dissociate on a SiO2 surface. On the other hand, when W and SiO2 surfaces are exposed to WF6 at temperatures from 20 to 300 °C, no adsorbed species are observed by FTIR RAS. However, WF6 can easily react with the Si-containing adsorbed species on a W surface to form W and byproduct gases of SiHF3 and SiF4. The main surface reaction of selective W CVD can be expressed as WF6+2SiH4=W+2SiHF3+3H2. These experimental results support the selective W-CVD mechanism previously proposed, which shows that dissociation of SiH4 and not the dissociation of WF6 has a central role in this process.
    Type of Medium: Electronic Resource
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