In:
Journal of Applied Physics, AIP Publishing, Vol. 124, No. 8 ( 2018-08-28)
Kurzfassung:
The thermal properties of polyimide thin films govern the temporal response of electric devices in highly integrated circuits. An innovative advanced method, called the Modal-Method, has been developed to investigate the in-plane anisotropic thermal diffusivities of 4 homopolymers of aromatic polyimide thin films, widely used in microelectronics. The proposed method is based on microscopic infrared thermography and consists of a single non-destructive fast experiment. A photo-thermal excitation is applied on the center of the film rear surface. The thermal response of the front surface, recorded by using an infrared camera equipped with a unique microscope lens, allows reaching high resolutions. The Modal-Method is then applied on the recorded thermal emission data. This method is robust to the measurement noise and allows estimating the in-plane thermal diffusivities of thin films. This method affords also the estimation of the effective heat transfer coefficient. This parameter, representing the heat exchanges between the films and their environment, is directly related to the signal/noise ratio and hence related to the quality of the estimation. Eventually, this method has been validated by comparison with temperature wave analysis results.
Materialart:
Online-Ressource
ISSN:
0021-8979
,
1089-7550
Sprache:
Englisch
Verlag:
AIP Publishing
Publikationsdatum:
2018
ZDB Id:
220641-9
ZDB Id:
3112-4
ZDB Id:
1476463-5
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