In:
Proceedings, annual meeting, Electron Microscopy Society of America, Cambridge University Press (CUP), Vol. 26 ( 1968-09), p. 386-387
Kurzfassung:
In order to completely understand the role of microstructural defects in superconductivity, it is very desirable to have quantitative correlations between superconducting properties and structural properties. This research is part of a study to correlate grain-sizes with “flux creep phenomena” which occur in the mixed state of Type II superconducting films. Since the superconducting properties in our study must be observed at liquid helium temperatures, whereas the films are evaporated at elevated temperatures, the structural changes produced in some films by cycling to 4.2°K have been investigated. As the temperature of a film is lowered, the difference in thermal expansion coefficients of a film and its substrate results in thermal stress. This stress can produce structural changes. Films have been examined by electron microscopy techniques before and after a temperature cycle down to 4.2°K and back to room temperature. All temperature cycles were carried out in approximately 20 minutes. Both transmission and replication techniques have been employed. The direct replication method was employed using carbon. The carbon replica was separated from the film and post-shadowed with Pt-C.
Materialart:
Online-Ressource
ISSN:
0424-8201
,
2690-1315
DOI:
10.1017/S0424820100101682
Sprache:
Englisch
Verlag:
Cambridge University Press (CUP)
Publikationsdatum:
1968
SSG:
11
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