In:
Review of Scientific Instruments, AIP Publishing, Vol. 48, No. 6 ( 1977-06-01), p. 688-692
Abstract:
An apparatus for measuring the thermoelectric power (TEP) of bulk and thin film materials is described. Spring tension-welded thermocouple probes are used to make electrical contact with the sample surface. The apparatus is small, simple, and can be used under different environmental conditions at various temperatures. It is also designed so that the sample can be easily and quickly mounted and removed. Measurements taken on n-type and p-type bulk Bi2Te3 samples and a thin copper film are reported. The effects of sample thickness and surface conditions on the measured TEP values and criteria for minimizing errors are discussed.
Type of Medium:
Online Resource
ISSN:
0034-6748
,
1089-7623
Language:
English
Publisher:
AIP Publishing
Publication Date:
1977
detail.hit.zdb_id:
209865-9
detail.hit.zdb_id:
1472905-2
SSG:
11
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