In:
Journal of Applied Physics, AIP Publishing, Vol. 46, No. 10 ( 1975-10-01), p. 4284-4290
Abstract:
Interdiffusion in the Ti/Rh/Au and Ti/Pt thin-film systems is measured using Rutherford backscattering. Extensive grain size measurements are used to interpret the data in terms of grain-boundary-assisted bulk diffusion. At room temperature, rapid grain-boundary diffusion of Au into the fine-grained Rh layer of the Ti-Rh-Au films occurs, characterized by a diffusion coefficient DB∼10−16 cm2/sec. The bulk diffusion of Au into the grains of the Rh film layer is examined using the grain-boundary-assisted bulk diffusion model, and the influence of surface segregation and size effects is discussed. It is found that interdiffusion in Ti-Rh and Ti-Pt couples is much slower than in Ti-Pd or Ti-Au. Methods are suggested by which the utility of Ti-Rh-Au as a conductor metallization might be improved.
Type of Medium:
Online Resource
ISSN:
0021-8979
,
1089-7550
Language:
English
Publisher:
AIP Publishing
Publication Date:
1975
detail.hit.zdb_id:
220641-9
detail.hit.zdb_id:
3112-4
detail.hit.zdb_id:
1476463-5
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