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  • 1990-1994  (2)
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  • 1
    ISSN: 1432-0614
    Source: Springer Online Journal Archives 1860-2000
    Topics: Biology , Process Engineering, Biotechnology, Nutrition Technology
    Notes: Summary A biotransformation procedure has been developed to prepare intermediates for the synthesis of 3-hydroxyphenylacetylene (3-HPA), a high-value specialty chemical used in the manufacture of acetylene-terminated resins. Pseudomonas putida F39/D containing toluene dioxygenase was used to oxidize a series of substituted benzenes to their respective cis-2,3-dihydroxydihydrobenzene(cis-dihydrodiol) derivatives which in turn could be converted to 3-HPA via a meta-phenol intermediate obtained by acid-catalyzed dehydration. The cis-dihydrodiols derived from the oxidation of phenylacetylene, styrene, acetophenone, and bromobenzene dehydrated to yield predominantly ortho-phenols. Three different phenyl-1,3-dioxolanes were oxidized by P. putida F39/D to three previously undescribed cis-dihydrodiols. Unlike mono-substituted cis-dihydrodiols, phenyl-1,3-dioxolane cis-dihydrodiols were dehydrated to form meta-phenols exclusively. The dehydration products, 3-hydroxyacetophenone and 3-hydroxybenzaldehyde, are suitable precursors for the chemical synthesis of 3-HPA.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 17 (1991), S. 471-476 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Composite surfaces before and after pretreatment for adhesive bonding have been examined by x-ray photoelectron spectroscopy (XPS) and the extent of transfer of release agents or other contaminants from release agents, which also were analysed by XPS, was estimated. Composite surfaces were examined also by optically stimulated electron emission (OSEE). Surface analyses were correlated with the strengths of adhesive bonded joints. OSEE shows promise as a non-destructive method for determining the bondability of epoxy resin matrix composites.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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